A method for providing a substrate coating comprises transferring a substrate to an enclosed ink jet printing system; printing organic material in a deposition region of the substrate using the enclosed ink jet printing system, the deposition region comprising at least a portion of an active region of a light-emitting device on the substrate; loading the substrate with the organic material deposited thereon to an enclosed curing module; supporting the substrate in the enclosed curing module, the supporting the substrate comprising floating the substrate on a gas cushion established by a floatation support apparatus; and while supporting the substrate in the enclosed curing module, curing the organic material deposited on the substrate to form an organic film layer.

A wafer inspection device for inspecting presence or absence of a defect in a wafer, the wafer inspection device includes: a stage on which the wafer is horizontally floated above an air hole block by exhausting air from the air hole block; a transport unit to transport the wafer; an inspection information acquisition unit; and a detection unit, in which the transport unit includes an abutment unit that abuts against an outer peripheral edge of the wafer horizontally floated above the stage by the air, and a drive unit that moves the abutment unit with respect to the stage, and moves the wafer in the one direction by moving the abutment unit with respect to the stage by the drive unit, and allow the wafer to pass through the inspection information acquisition unit while horizontally floating the wafer.

An atomic layer deposition apparatus comprising a first single substrate process chamber, a second single substrate process chamber, and a transfer mechanism configured to transfer the substrate between the first and the second process chamber. Wherein both the first and second single substrate process chambers are bounded by a bottom part and a top part for accommodating a substantially flat substrate between them.

A system includes a plurality of spindle arms located above a plurality of stations in a processing chamber to transport a semiconductor substrate between the stations. The spindle arms reside in the processing chamber during processing of the semiconductor substrate. The system comprises first gas lines arranged below the stations to supply a purge gas. The system comprises second gas lines extending upwards from the first gas lines to supply the purge gas to the spindle arms during the processing of the semiconductor substrate in the processing chamber.