A semiconductor package assembly and an electronic device are provided. The semiconductor package assembly includes a base, a system-on-chip (SOC) package, a memory package and a silicon capacitor die. The base has a first surface and a second surface opposite the first surface. The SOC package is disposed on the first surface of the base and includes a SOC die having pads and a redistribution layer (RDL) structure. The RDL structure is electrically connected to the SOC die by the pads. The memory package is stacked on the SOC package and includes a memory package substrate and a memory die. The memory package substrate has a top surface and a bottom surface. The memory die is electrically connected to the memory package substrate. The silicon capacitor die is disposed on and electrically connected to the second surface of the base.

Semiconductor devices, and related systems and methods, are disclosed herein. In some embodiments, the stacked semiconductor device includes a package substrate having an inner surface, a die stack carried by the inner surface, and a stacked capacitor device carried by the inner surface adjacent to the die stack. The die stack can include one or more semiconductor dies, each of which can be electrically coupled to the inner surface by one or more bond wires and/or solder structures. The stacked capacitor device can include a first capacitor having a lower surface attached to the inner surface of the package substrate, a interposer having a first side attached to an upper surface of the first capacitor, and a second capacitor attached to a second side of the interposer opposite the first side.

According to one embodiment, a semiconductor device includes a first transistor and a second transistor whose source electrodes are electrically coupled to each other; a light emitter; a light receiver including a first cathode electrode and a second cathode electrode and configured to turn the first transistor and the second transistor on or off, depending on a light emission state of the light emitter; a first filter electrically coupling the first cathode electrode of the light receiver and the source electrode of the first transistor; and a second filter electrically coupling the second cathode electrode of the light receiver and the source electrode of the second transistor.

According to one embodiment, an isolator includes: an isolator module including a first coil and a second coil that are separated with respect to a first direction and face each other; a magnetic member provided on the isolator module in such a manner that the magnetic member overlaps the first coil and the second coil when viewed in the first direction; and an insulating member covering the isolator module and the magnetic member.

An integrated device provides a measure of a quantity dependent on current through an electrical conductor, having: a sensing and processing sub-system: an electrical conductor conducting current: an insulating material encapsulates the sensing and processing sub-system and maintains the electrical conductor in a fixed and spaced relationship to the sensing and processing sub-system. The insulating material insulates the electrical conductor from the sensing and processing sub-system. Sensing and processing sub-system sensing circuitry includes magnetic field sensing elements adjacent the electrical conductor. The sensing circuitry provides a measure of the quantity as a weighted sum and/or difference of magnetic field sensing elements outputs caused by current through the electrical conductor adjacent the magnetic field sensing elements. A voltage sensing input senses a measure of voltage associated with the current conductor. Sensing and processing sub-system output circuitry provides an output measure of the quantity from the sensed measure of current and voltage.