A display panel comprising a display substrate having a display area and a pad area disposed around the display area. A connection wire is disposed on the pad area of the display substrate. A signal wire is disposed on the connection wire. A supporter is disposed between the display substrate and the connection wire. The connection wire directly contacts the supporter.

According to one embodiment, a semiconductor device includes a substrate, at least one semiconductor part, and a non-semiconductor part. The substrate has a first face and a second face on a side opposite to that of the first face, and has a first linear expansion coefficient. The at least one semiconductor part is disposed on a first region of the first face, and has a second linear expansion coefficient that is smaller than the first linear expansion coefficient. The non-semiconductor part is disposed on a second region of the first face, on which no semiconductor part is disposed, and has a third linear expansion coefficient that is greater than the first linear expansion coefficient.

A semiconductor package includes a substrate including a first layer, a plurality of structures extending in a first direction on the first layer by a first length and including the same materials as the first layer, and a first semiconductor chip bonded to the substrate, wherein a separation distance in the first direction between a first surface of the first semiconductor chip facing the substrate and the substrate is determined by the first length.