A display panel comprising a display substrate having a display area and a pad area disposed around the display area. A connection wire is disposed on the pad area of the display substrate. A signal wire is disposed on the connection wire. A supporter is disposed between the display substrate and the connection wire. The connection wire directly contacts the supporter.

A manufacturing method for a semiconductor device according to an embodiment includes a first step deforming a bump of a semiconductor element by applying a first load to the semiconductor element to press the bump onto a circuit board and applying either no ultrasonic vibration or ultrasonic vibration with a first strength to the bump and a second step, after the first step, bonding the bump to a pad of the circuit board by applying a second load to the semiconductor element to press the bump and applying ultrasonic vibration with a second strength stronger than the first strength to the bump.