A method of manufacturing a semiconductor device is provided. The method includes forming a package leadframe including a die pad, a first ridge formed at a first outer edge of the die pad, a second ridge formed at a second outer edge of the die pad opposite of the first outer edge and separate from the first ridge, and a plurality of leads surrounding the die pad. A semiconductor die is attached to the die pad by way of a die attach material. The semiconductor die is located on the die pad between the first ridge and the second ridge. An encapsulant encapsulates the semiconductor die and at least a portion of the package leadframe.

A method of forming a semiconductor device includes the following steps. A substrate is provided. A die is placed on the substrate, wherein an empty through hole penetrates through the die. A cavity is formed to penetrate through the substrate, to communicate with the empty through hole of the die. A liner is formed on surfaces of the empty through hole of the die and the cavity of the substrate.

A semiconductor package includes a semiconductor die; a die pad having a first surface coupled to the semiconductor die and a second surface opposite the first surface, the die pad including an extension that comprises a first V-shaped groove in the second surface; a first conductive terminal having first and second ends and a third surface facing a same direction as the second surface, the third surface comprising a second V-shaped groove; a second conductive terminal having third and fourth ends and a fourth surface facing the same direction as the second surface, the fourth surface comprising a third V-shaped groove, the extension in between the second and fourth ends; and a mold compound covering the die, the die pad, and the first and second conductive terminals, the mold compound filling the first, second, and third V-shaped grooves, and the first and third ends extending to an exterior of the mold compound.

A method for manufacturing a singulated semiconductor product from a package is provided, and includes the steps of a) providing the bottom frame with the clip matrix with a semiconductor component and placing them in a mold cavity, b) closing the mold, c) moving retractable pins through openings in the mold, so that the tips of the pins come into contact with the tie bars or the clip tie-bars of the clip matrix, d) performing the molding operation using the encapsulating material, e) retracting the pins away from the package, f) opening the mold, g) removing the package from the mold, and h) singulating the package into a separate product by sawing along and trimming the microleads. With the above steps at least one encapsulated and singulated semiconductor product is formed, that has notches formed on the sides thereof, that expose either tie bars or clip tie-bars.