A substrate processing method includes: supplying a pre-wet liquid to a substrate while rotating the substrate, and forming a liquid film of the pre-wet liquid on a surface of the substrate; supplying a chemical liquid at a first flow rate to the substrate while the substrate is being rotated at a first rotation speed, and processing the substrate with the chemical liquid to form a liquid film of the chemical liquid having a first thickness on the surface of the substrate; and supplying the chemical liquid to the substrate at a second supply flow rate while the substrate is being rotated at a second rotation speed, and performing a second chemical liquid processing on the substrate with the chemical liquid to form a liquid film of the chemical liquid having a second thickness on the surface of the substrate.

A system may automatically conduct hygiene cycles for a confined space such an interior space of a box suitable for storing and/or carrying packaged food. The system may include a hygiene device that can be attached to the box to conduct the hygiene cycles and a user interface device that can wirelessly communicate with the hygiene device to control the conduction of the hygiene cycles. The system may also automatically collect information related to the hygiene cycles using the hygiene device and transmit the collected information to a network directly or through the user interface device.

The present invention relates to an etching device and an etching method thereof, the etching device comprising: an etchant supply unit for supplying an etchant to an etching chamber; a rinsing liquid supply unit for supplying a rinsing liquid to the etching chamber, a cleaning liquid supply unit for supplying a cleaning liquid to the etching chamber, and a first pressurization maintaining unit for maintaining at least one of the etching chamber and the etchant supply unit in a pressurized atmosphere.

A system including one or more semiconductor processing chambers, and a processing fluid supply system including an input portion configured to receive a first fluid, and a heated flow portion configured to deliver a heated processing fluid comprising the first fluid to the one or more semiconductor processing chambers. A waste system is configured to receive hot waste fluid from the heated flow portion and/or the semiconductor processing chambers. A plurality of heat pumps are connected in series and/or parallel configuration to provide a common source loop and a common load loop. The common source loop is thermally coupled to an external heat source. A first heat exchanger including a first supply-side flow path in fluid communication with the input portion, and a first heat delivery-side flow path in fluid communication with the common load loop such that the first heat exchanger heats the first fluid.

A wafer cleaning apparatus according to the present disclosure includes a rotary table that supports and rotates a wafer so that the wafer rotates about a rotational axis, and an ultrasonic vibration device that vibrates a liquid film so that vibration having an ultrasonic frequency is generated in the liquid film formed on an upper surface of the wafer.

A wet-processing dark laboratory for scientific research includes a laboratory body, a wet-processing equipment, a transfer robot, a sample supplying and storing apparatus, a chemical supplying and storing apparatus, and a control apparatus. The laboratory body is configured to provide a clean space. The transfer robot includes a moving device, a mechanical arm device, at least one end effector, and an accompanying device. The accompanying device can move with the moving device and provide a temporary storage space. The mechanical arm device is mounted on the moving device. The at least one end effector is mounted on the mechanical arm device for grasping a semiconductor sample and/or a chemical tank. The above design enables 24/7 experiments conduction without the need for human presence, which forms a dark laboratory.