A non-conductive encapsulation cover is mounted on a support face of a support substrate to delimit, with the support substrate, an internal housing. An integrated circuit chip is mounted to the support substrate within the internal housing. A metal pattern is mounted to an internal wall of the non-conductive encapsulation cover in a position facing the support face. At least two U-shaped metal wires are provided within the internal housing, located to a side of the integrated circuit chip, and fixed at one end to the metallic pattern and at another end to the support face.

Various aspects of the present disclosure generally relate to an integrated circuit device, such as a packaged integrated circuit device. In some aspects, an integrated circuit device includes a semiconductor die and a lid thermally coupled to the semiconductor die. The lid includes a two-phase thermal management device. The integrated circuit device also includes an interface layer in contact with the semiconductor die and the lid.

A method and apparatus are provided which manages the movement of thermal interface material (TIM) squeezed out from between a lid and an IC die of an IC (chip) package. In one embodiment, a chip package is provided that includes an IC die mounted on a substrate and covered by a lid. A bottom surface of the lid has a die overlapped region facing a top surface of the IC die. The bottom surface of the lid has a first gutter formed therein. An outer sidewall of the first gutter is formed outward of the first die overlapped region as to receive TIM squeezed out from between a lid and an IC die.

The present disclosure provides a three-dimensional stacking fan-out packaging device and a method for preparing a three-dimensional stacking fan-out packaging device, and relates to the field of chip packaging. In this device, the concave chip bonding area is defined by the pre-supported electrical connection frame; a plurality of first chips with functional surfaces towards the first direction and a plurality of second chips with functional surfaces towards the second direction are arranged in the chip bonding area; and the first stacking chip and the second stacking chip are arranged in a central symmetry or plane symmetry.

A semiconductor apparatus, including: a conductive pattern; and a terminal that includes a bonding portion that has a rear surface bonded to the conductive pattern, a rising portion extending upward from the bonding portion, and a joining portion that joins the bonding portion and the rising portion without being bonded to the conductive pattern. The bonding portion has, on a front surface thereof, a plurality of rows of indentations, the indentations in each row being aligned in a first direction up to a boundary between the bonding portion and the joining portion. Each indentation has a recess. Any two of the recesses that are adjacent in a second direction perpendicular to the first direction are disposed at positions that are displaced from each other in the first direction. Each recess has a deepest point. The deepest points of the recesses are positioned away from the boundary.

A semiconductor apparatus includes: a base plate; an insulating circuit board including a ceramic substrate, a circuit pattern formed on an upper surface of the ceramic substrate, a metal layer formed on a lower surface of the ceramic substrate and fixed on an upper surface of the base plate with a first joint material; a semiconductor device having a first surface fixed on the circuit pattern with a second joint material and a second surface which is an opposite surface of the first surface; a lead frame fixed on the second surface with a third joint material; and a case fixed to an outer edge portion of the base plate and enclosing the semiconductor device, wherein restoring force acts on the insulating circuit board in a direction of warpage that is convex upward, and restoring force acts on the base plate in a direction of warpage that is convex downward.

A pressing method and a pressing device are provided. The pressing method includes providing an object to be pressed, and lower and upper pressing dies. The upper pressing die includes a driving mechanism and a pressing block mechanism driven by the driving mechanism. The driving mechanism includes a main body having a chamber for accommodating a fluid, a piston for changing a pressure of the fluid in the chamber via displacement, and plungers. In pressing, the pressing block mechanism presses the object, the pressing block mechanism applies an upward pressure to the plungers, and the driving mechanism uses the piston to act on the fluid in the chamber to indirectly apply a reverse downward pressure to the plungers through the fluid to make the plungers press the object. Therefore, a driving force of the piston is divided into driving forces of the plungers, and the downward pressure is ensured.

The present invention provides a pressing method and device. The pressing method includes providing an object to be pressed that is formed by covering an upper side of an integrated circuit element with a lid and includes pressing sections of different heights on the lid; providing a lower pressing die including a support seat for holding the object; providing an upper pressing die that can be driven to move up and down relative to the lower pressing die; the upper pressing die includes a pressing block mechanism that can be driven by a driving mechanism; and the pressing block mechanism includes pressing block modules. When pressing the object, the upper pressing die is lowered until the pressing block mechanism presses the lid, and the driving mechanism drives the pressing block modules to respectively press the pressing sections. Therefore, pressure can be applied to the pressing sections of different heights.

The present invention provides a pressing method and a pressing device. The method includes: providing an object to be pressed that is provided with pressing sections on an upper surface; providing a lower pressing die that is provided with a support seat for holding the object to be pressed; providing an upper pressing die that can be driven to move up and down relative to the lower pressing die and is provided with a driving mechanism and a pressing block mechanism that can be driven by the driving mechanism, and the pressing block mechanism is provided with independent and separated pressing block modules; and when the object to be pressed is pressed, the pressing block mechanism of the upper pressing die presses the upper surface of the object to be pressed, and the pressing block modules respectively apply pressure to the pressing sections of the object to be pressed.

The present disclosure relates to a power semiconductor module including: a carrier; a plurality of semiconductor dies mounted onto the carrier; a housing including a frame enclosing the carrier circumferentially; a first external connection electrically connected to a first subset of the semiconductor dies, the first external connection protruding laterally from the housing at a first level; and an insert including an electrically isolating material and a second external connection mounted onto the electrically isolating material. The insert is at least partially mounted to the frame and at least partially covers the carrier and/or the first subset of the plurality of semiconductor dies. The second external connection is connected to a second subset of the plurality of semiconductor dies. The second external connection protrudes from the housing.