An assembly for semiconductor die transfer includes a carrier wafer, semiconductor dies oriented with proximal surfaces thereof facing the carrier wafer, and pillars comprising an organic polymer material supporting the semiconductor dies on the carrier wafer. The pillars have distal ends filling recesses in the proximal surfaces of the semiconductor dies. A semiconductor die of the semiconductor die transfer structure is picked up using a pick-and-place tool. To fabricate the structure, a dielectric layer is disposed on the proximal surfaces of the semiconductor dies, and openings are etched in the dielectric layer and the etching is continued into the proximal surfaces of the semiconductor dies to form the recesses therein. The dielectric layer is bonded to the carrier wafer using the organic polymer material which also fills the openings in the dielectric layer and the recesses in the proximal surfaces of the semiconductor dies. The dielectric layer is removed.

A micro-semiconductor chip transfer apparatus includes: a wet chip supply module configured to supply a plurality of micro-semiconductor chips and liquid onto a transfer substrate; a chip alignment module including an absorber configured to move along a surface of the transfer substrate while absorbing the liquid; and a chip extraction module configured to extract, from the absorber, the micro-semiconductor chips remaining in the absorber.

A module tray for a semiconductor device includes a base plate, and first and second sidewalls extending in a vertical direction on the base plate to define an accommodating space in which a semiconductor substrate is accommodated. The first and second sidewalls include first and second support portions and first and second fastening grooves respectively. The first and second support portions have seating surfaces for supporting a lower surface of the semiconductor substrate in the accommodating space. The first and second fastening grooves respectively extend along the seating surfaces and are configured to temporarily fix the semiconductor substrate through predetermined shapes that correspond to both side portions of the semiconductor substrate.

A wafer handling device is configured to transport a wafer tray. The wafer handling device includes a sucker module and a transporting apparatus. The sucker module includes a sucker body, at least one airtight assembly, and a pump. The sucker body includes a first portion and a second portion. The first portion has a hole and a first air sucking hole. The second portion has a second air sucking hole. The airtight assembly is connected to the hole. The pump has a suction tube connected to the first air sucking hole and the second air sucking hole. The transporting apparatus is configured to move the sucker body. When the sucker body is connected to the wafer tray, the first portion, the second portion, and the wafer tray form an airtight space.

A module tray for a semiconductor device includes a case body defining at least one cavity therein to accommodate a semiconductor substrate on a bottom surface of the cavity. The case body defining first and second inner walls of the at least one cavity extending parallel to each other in a first horizontal direction and having first and second end portions, third and fourth inner walls of the at least one cavity extending parallel to each other in a second horizontal direction orthogonal to the first horizontal direction and having third and fourth end portions, and first to fourth guide grooves of the at least one cavity respectively extending to connect the first to fourth end portions to each other, the first to fourth guide grooves having a concave shape to be spaced apart from corner portions of the semiconductor substrate that is accommodated into the cavity.

The present invention relates to the technical field of chip fixtures. Disclosed is a chip mounting fixture, comprising: a fixture body, wherein the fixture body is provided with chip slots which are uniformly distributed in an array and are used for accommodating chips, recessed wire slots are formed at the chip slots, and the wire slots extend to the outer sides of the chip slots. The present invention facilitates taking out a processed chip product, and the operation mode is convenient.

The present invention relates to a method of manufacturing a display device, and more particularly, to a chip tray for supplying a micro-LED. The present invention provides a chip tray for transporting semiconductor light emitting devices in a fluid contained in an assembly chamber. Specifically, the present invention includes a tray for accommodating a plurality of semiconductor light emitting devices, a chip supply unit configured to supply a plurality of semiconductor light emitting devices to the tray unit and a nozzle unit disposed on the tray unit and configured to supply the semiconductor light emitting devices accommodated in the chip supply unit onto the tray unit. And the nozzle unit includes holes formed at predetermined intervals on the tray unit to supply the semiconductor light emitting devices at predetermined intervals.

A method for calibrating a tray shield used for holding a wafer for processing is provided. The tray shield is in a ring shape. The method includes determining whether a first calibration ring is placeable into an inner chamber of the tray shield. When the first calibration ring is placeable into the inner chamber, the tray shield is determined to be usable for wafer processing. The first calibration ring is moved around inside the inner chamber to remove metal particles or burrs on the inner chamber, and thereafter, a wafer is loaded in the inner chamber. When the first calibration ring is not placeable into the inner chamber, the tray shield may be discarded. The method may also include assembling the tray shield utilizing a second calibration ring having an outer diameter equal to an inner diameter of the ring shape.