The present disclosure relates to a flip-chip based moisture-resistant module, which includes a substrate with a top surface, a flip-chip die, a sheet-mold film, and a barrier layer. The flip-chip die has a die body and a number of interconnects, each of which extends outward from a bottom surface of the die body and is attached to the top surface of the substrate. The sheet-mold film directly encapsulates sides of the die body, extends towards the top surface of the substrate, and directly adheres to the top surface of the substrate, such that an air-cavity with a perimeter defined by the sheet-mold film is formed between the bottom surface of the die body and the top surface of the substrate. The barrier layer is formed directly over the sheet-mold film, fully covers the sides of the die body, and extends horizontally beyond the flip-chip die.

A semiconductor device includes a substrate. A semiconductor die is disposed over the substrate. An encapsulant is deposited over the substrate and semiconductor die. A first trench is formed in the encapsulant over the semiconductor die. A conductive layer is formed over the encapsulant and into the first trench.

An electrical power module includes a base plate, including an electrically isolating substrate and a first metallic layer formed on a first side of the electrically isolating substrate. The electrical power module also includes electrical connection pillars extending from the first metallic layer. The electrical power module further includes at least one encapsulant retention feature extending from the first metallic layer and including at least one surface that is angled or parallel relative to the first side of the electrically isolating substrate and faces the first side of the electrically isolating substrate. The electrical power module additionally includes at least one electrical component electrically coupled with the metallic layer of the base plate. The electrical power module further includes an encapsulant encapsulating the at least one electrical component, the metallic layer, and the at least one encapsulant retention feature and partially encapsulating the electrical connection pillars.

A method of making an electronics package for an electrical power module includes positioning a base plate into an electrolyte solution such that a first metallic layer of the base plate directly contacts the electrolyte solution. The method also includes positioning a deposition anode array into the electrolyte solution such that a gap is established between the first metallic layer and the deposition anode array. The method further includes connecting the first metallic layer to a power source and connecting the deposition anode array to the power source. The method also includes transmitting electrical energy from the power source through the deposition anode array, through the electrolyte solution, and to the first metallic layer, such that material is deposited onto the first metallic layer and forms an electrical connection pillar, an electrical-component retention feature, and an encapsulant retention feature of the electronics package.

A sensor package structure includes a substrate, a sensor chip disposed on the substrate, a plurality of first metal wires, a plurality of second metal wires, a ring-shaped supporting layer formed on the sensor chip, and a light-permeable sheet. The first metal wires and the second metal wires are connected to the substrate and the sensor chip. Each edge of a top surface of the sensor chip is provided with at least one of the second metal wires adjacent thereto. Each of the second metal wires has a highest endpoint that is higher than a highest endpoint of any one of the first metal wires with respect to the substrate, and the light-permeable sheet is disposed on the ring-shaped supporting layer and abuts against the highest endpoints of the second metal wires, such that the first metal wires are not in contact with the light-permeable sheet.

A chip packaging structure includes a first substrate, an image sensor chip, a first molding layer, conductive pillars, metal wires, an adhesive layer, a second substrate, and a second molding layer. The first substrate includes traces between its upper surface and lower surface. The image sensor chip is fixed on the first substrate. The first molding layer is disposed on the first substrate and covers a side surface of the image sensor chip. The conductive pillars are disposed in the first molding layer, and the metal wires electrically connects the image sensor chip to the conductive pillars. The adhesive layer is disposed on the first molding layer and surrounds the image sensor chip. The second substrate is fixed on the adhesive layer. The second molding layer is disposed on the first molding layer and covers a side surface of the adhesive layer and a side surface of the second substrate.

An integrated sensor component includes a chip carrier and a first semiconductor chip and a second semiconductor chip, wherein either both semiconductor chips are arranged on the chip carrier or (alternatively) the second semiconductor chip is arranged on the chip carrier and the first semiconductor chip is arranged on the second semiconductor chip (chip-on-chip). The integrated sensor component further includes a first sensor element integrated in the first semiconductor chip and a second sensor element integrated in the second semiconductor chip, as well as a housing formed by a potting compound, which has an opening. Both the first sensor element and the second sensor element are located within the opening so that they can interact with the atmosphere surrounding the sensor component.

A sensor package includes a circuit substrate, a sensor die, an electrical connection, a dielectric dam, a cover layer, and an encapsulant. The circuit substrate includes a first side, a second side opposite to the first side, and a cavity recessed from the first side toward the second side. The sensor die is disposed in the cavity and includes a first side, a sensing area on the first side, and a second side opposite to the first side and facing the circuit substrate. The electrical connection electrically connects the first sides of the sensor die and the circuit substrate. The dielectric dam is disposed on the first side of the circuit substrate and outside the cavity, and the dielectric dam partially covers the electrical connection. The encapsulant is disposed on the first side of the circuit substrate and laterally covers the dielectric dam and the cover layer.

According to one embodiment, a semiconductor device includes: a circuit board; a first semiconductor chip mounted on a face of the circuit board; a resin film covering the first semiconductor chip; and a second semiconductor chip having a chip area larger than a chip area of the first semiconductor chip, the second semiconductor chip being stuck to an upper face of the resin film and mounted on the circuit board. The resin film entirely fits within an inner region of a bottom face of the second semiconductor chip when viewed in a stacking direction of the first and second semiconductor chips.

In examples, a semiconductor package includes a semiconductor die including a device side having circuitry formed therein and a non-device side opposite the device side. The semiconductor package includes a mold compound dam on the device side, the mold compound dam comprising a non-metallic material. The semiconductor package includes a mold compound on the device side of the semiconductor die and contacting an outer wall of the mold compound dam, the mold compound absent from a cavity defined by the mold compound dam.