A semiconductor module includes a plate-shaped base made of metal, and a frame-shaped housing made of a resin composition, the housing having an adhering portion adhering to an outer peripheral portion of the base, wherein in plan view, an outer periphery of the housing includes first sides facing each other and second sides facing each other, a portion of the housing corresponding to each of the second sides is provided with at least one hole for screwing a heat dissipating member, the adhering portion includes a plate-shaped first adhering portion extending along each of the first sides, in plan view, the first adhering portion overlaps an outer periphery of the base, and inequality T.sub.1<0.42L.sub.1.sup.2 is satisfied, when T.sub.1 is T.sub.1 meters that denote a thickness of the first adhering portion, and L.sub.1 is L.sub.1 meters that denote a length of the first adhering portion.

A semiconductor device includes: an insulated circuit substrate including a base plate, a resin layer on the base plate, and a circuit pattern on the resin layer; a semiconductor chip that is rectangular and is bonded to the circuit pattern such that a side edge of the semiconductor chip is spaced inwardly from an outer peripheral edge of the circuit pattern by a predetermined distance; a case on the resin layer and surrounds the circuit pattern and the semiconductor chip; and a sealing material that covers the insulated circuit substrate and semiconductor chip and is surrounded by the case. The predetermined distance and thickness of the circuit pattern are greater than or equal to 0.1 of a length of one side of the semiconductor chip. A peripheral region of the case and a peripheral region of the resin layer are connected to each other via an adhesive layer.

A semiconductor package includes a substrate with electrical conductors, one or more semiconductor dies disposed on the substrate and electrically connected with the electrical conductors of the substrate, and a lid disposed on the substrate. The one or more semiconductor dies are disposed in a space enclosed by the substrate and the lid. At least one thermoelectric device is at least partly embedded in the lid. The at least one thermoelectric device may be operated to cool the semiconductor package, or to heat the semiconductor package. A controller for the at least one thermoelectric device may be implemented in the one or more semiconductor dies.

A resin enclosure includes: an inner wall portion from a wall surface defining the space to a side surface of the lead terminal close to the space; and a covering portion that covers at least a part of a top surface of a first portion of the lead terminal.

A semiconductor module arrangement includes: a housing; a substrate arranged in or forming a bottom of the housing; a bus bar including a first end and a second end opposite the first end, the first end being arranged inside the housing and the second end extending to outside of the housing; and at least one connecting element mechanically and electrically coupled to a top surface of the substrate. The first end of the bus bar is arranged distant from the substrate in a vertical direction. The vertical direction is a direction perpendicular to the top surface of the substrate. The first end of the bus bar is electrically coupled to at least one of the at least one connecting element by one or more electrical connections.

An electronic device includes one or more power semiconductor dies and a plurality of sleeves attached to a substrate. The electronic device further includes an electrically insulative enclosure that laterally encloses the one or more power semiconductor dies, and a plurality of pins providing an electrical interface for the electronic device. A proximal end of each pin is inserted into one of the plurality of sleeves. One or more of the pins has a bent profile and includes a first segment and a third segment that are oriented substantially perpendicular to the substrate and are offset from one another in a direction that is parallel to the substrate, and a second segment interposed between and electrically coupling the first segment and the third segment. At least a part of the first segment and at least a part of the second segment are covered by an electrically insulative material.

A semiconductor apparatus includes a substrate (12), a semiconductor chip (14) disposed on the substrate (12), a side wall (16) disposed on the substrate (12) and surrounding the semiconductor chip (14), and a lid (18) disposed on the side wall (16) and above the semiconductor chip (14) to form a hollow structure (22) together with the substrate (12), the semiconductor chip (14), and the side wall (16), the lid (18) including a penetrating portion (20) penetrating through the lid (18) to the interior of the hollow structure (22).