A die transfer system includes a carrier wafer with an adhesive layer on an upper surface of the carrier wafer that comprises a patterned bottom layer and a guard ring over a perimeter of the carrier wafer.

Discloses is a tray including a baseplate (1), wherein a positioning unit (3) for supporting a product is arranged on the baseplate (1), the positioning unit (3) includes a plurality of positioning assemblies (30) distributed on an upper surface of the baseplate (1) and enclosing a placement area (300) therebetween; a first groove (13) is arranged on the upper surface of the baseplate (1), and a through hole (130) is opened within the first groove (13); each of the plurality of positioning assemblies (30) includes a positioning body (301) and a covering body (302), the positioning body (301) is arranged within the first groove (13), and the covering body (302) covers the first groove (13) and a surface of the positioning body (301), and the covering body (302) passes through the through hole (130) and covers a part of a lower surface of the baseplate (1).

Proposed is a masking device for a packaging tray, which enables laser processing of a chip without thermal damage to a packaging tray by installing the masking device on the packaging tray while the chip placed on the packaging tray is vertically raised by a heating block. The masking device may include a mask part installed in a grid shape above a packaging tray in which a mounting part on which a chip is mounted is provided to form a number of rows and columns to protect the packaging tray from a heat source.

A semiconductor device is made with a boat carrier including stainless steel. A Polytetrafluoroethylene (PTFE) layer is formed over the boat carrier. A semiconductor package substrate is disposed over the boat carrier. A manufacturing step is performed on the semiconductor package substrate. An electrostatic discharge (ESD) is imparted on the boat carrier during the manufacturing step. The semiconductor package substrate is protected from the ESD by the PTFE layer.