Systems for transporting a plurality of semiconductor structures, wafer boats for holding the plurality of semiconductor structures and methods for heating a set of semiconductor wafers. In some embodiments, the wafer boat frame is made of a metal and the combs are made of quartz. The wafer boats may include one or more combs that are able to float within a comb holder during heating of the wafer boat.

Systems for transporting a plurality of semiconductor structures, wafer boats for holding the plurality of semiconductor structures and methods for heating a set of semiconductor wafers. In some embodiments, the wafer boat frame is made of a metal and the combs are made of quartz. The wafer boats may include one or more combs that are able to float within a comb holder during heating of the wafer boat.

Embodiments of the present disclosure generally relate to mass arrangements for lift frames, and related substrate processing chambers, chamber kits, and methods. In one or more embodiments, a processing chamber includes a chamber body including a plurality of gas inject passages formed in the chamber body. The chamber body at least partially defines an internal volume. The processing chamber includes a substrate support assembly positioned in the internal volume. The substrate support assembly includes a lift frame. The lift frame includes a plurality of arms and a ring supported by the plurality of arms. The lift frame includes a plurality of sections azimuthally spaced from each other. The plurality of sections have a different transmissivity than the ring.

A semiconductor device is made with a boat carrier including stainless steel. A Polytetrafluoroethylene (PTFE) layer is formed over the boat carrier. A semiconductor package substrate is disposed over the boat carrier. A manufacturing step is performed on the semiconductor package substrate. An electrostatic discharge (ESD) is imparted on the boat carrier during the manufacturing step. The semiconductor package substrate is protected from the ESD by the PTFE layer.