A substrate processing apparatus includes an O-ring defined by a central axis, a first guide ring located closer to the central axis than is the O-ring, and a second guide ring located further from the central axis than is the O-ring. A thickness of each of the first guide ring and the second guide ring becomes progressively greater further from the central axis.

The present application relates to a filler-application apparatus for applying a filler to a gap formed between edge portions of a plurality of substrates that constitute a laminated substrate. The filler-application apparatus includes: a substrate holder configured to hold and rotate a laminated substrate manufactured by bonding a first substrate and a second substrate; an application device located away from the laminated wafer held by the substrate holder, and configured to inject a filler toward a gap formed between a peripheral portion of the first substrate and a peripheral portion of the second substrate; and a protector configured to prevent liquid splashes of the filler, which occur when the filler injected from the application device collides with the gap, from coming into contact with an upper surface and/or a lower surface of the laminated substrate.

An electrostatic discharge (ESD) mitigating article for storing a semiconductor device or for transporting a process fluid during semiconductor manufacturing is provided. The article includes a conductive polymer that comprises conjugated segments of arylene or heteroaryl groups connected to each other via an optional vinylene group, ethynylene group or a divalent linker comprising a carbon, nitrogen, oxygen, sulfur, selenium, or silicon atom in the polymer backbone.

The present disclosure relates to a contamination controlled semiconductor processing system. The contamination controlled semiconductor processing system includes a processing chamber, a contamination detection system, and a contamination removal system. The processing chamber is configured to process a wafer. The contamination detection system is configured to determine whether a contamination level on a surface of the door is greater than a baseline level. The contamination removal system is configured to remove contaminants from the surface of the door in response to the contamination level being greater than the baseline level.

An apparatus for manufacturing a semiconductor package is provided. The apparatus includes: a chuck configured to hold an object, wherein the object includes a wafer-to-wafer bonding structure, the wafer-to-wafer bonding structure includes an edge area, and a gap is defined in the edge area between wafers; and a supply structure configured to dispense a sealant toward the gap of the wafer-to-wafer bonding structure while held in a vertical orientation.

A method and a system for manufacturing a semiconductor package structure are provided. The method includes: (a) measuring an amount of a molding powder; (b) controlling the amount of a molding powder; and (c) dispensing the molding powder on an assembly structure including a carrier and at least one semiconductor device disposed on the carrier.

A substrate processing apparatus includes a first chamber, a substrate loader under a first pressure and including a load port configured to load a substrate, a processing chamber inside the first chamber and including a processing bath in which a processing liquid for processing the substrate is provided and a bath cover configured to cover the processing bath, a processing liquid supplier configured to supply the processing liquid to the processing chamber, a first gas supply device configured to cause an internal pressure of the first chamber to be at a second pressure higher than the first pressure by supplying gas into the first chamber, and a second gas supply device configured to cause an internal pressure of the processing chamber to be at a third pressure higher than the first pressure by supplying gas into the processing chamber.

A method of transferring light-emitting diodes (LEDs) may include: placing a backplane on a backing board, wherein a sealing member is located around a periphery of the backplane; placing a plurality of first LED coupons on the backplane; placing a transparent panel on the sealing member and over the plurality of first LED coupons, such that a space is formed between the backing board and the transparent panel; drawing a vacuum on the space such that the transparent panel presses the plurality of first LED coupons toward the backplane; and directing laser radiation through the transparent panel to irradiate the plurality of first LED coupons located on the backplane.

Provided herein are a method of fabricating a display device and an apparatus for fabricating the display device. The method includes: forming a panel and a resin-type adhesive layer using a first jig; forming a cover window using a second jig; and coupling the panel to the cover window. The forming of the panel and the resin-type adhesive layer includes: placing the panel and the resin-type adhesive layer on a stage including an opening; and supporting, by a roller, a lower surface of the panel exposed through the opening of the stage.

A sealing system is provided. The system may obtain input data comprising at least one of a set of package parameters or a set of cover parameters. The system may, based the at least one of the set of cover parameters or the set of package parameters, place a cover on top of a package. The system may use vision data for programming of the seal operation. The system may apply a force to electrodes and apply a power pulse to create a hermetic seal.