A semiconductor device includes a low-voltage side frame configured to be connected to a low-voltage chip driven by an input voltage and connected to a ground potential; and a high-voltage side frame configured to be insulated from the low-voltage side frame and connected to a high-voltage chip supplied with a supply voltage having a higher voltage than the input voltage. The high-voltage side frame is connected to a reference potential.

A method of manufacturing a semiconductor device with an attached battery is provided. The method includes affixing a semiconductor die to a die pad region of a first battery lead of a leadframe. The first battery lead of the leadframe is separated from a second battery lead of the leadframe. An encapsulant encapsulates the semiconductor die and portions of the first and second battery leads of the leadframe. The battery is affixed to an exposed portion of the first battery lead of the leadframe such that a first terminal of the battery is conductively connected to the first battery lead. An exposed portion of the second battery lead of the leadframe is bent to overlap a top surface portion of the battery such that a second terminal of the battery conductively connected to the second battery lead.

A semiconductor device includes a semiconductor element, a first lead, and a sealing resin. The first lead includes a die pad portion including a first lead reverse surface, and a first terminal portion. The sealing resin includes a second resin surface facing in a z direction and a third resin surface facing in an x direction. The first lead includes a metal layer. The first lead reverse surface is exposed from the second resin surface. The first terminal portion includes a first-terminal base portion and a first-terminal tip portion. The first-terminal base portion passes through the third resin surface, and is spaced apart from a first resin surface in the z direction. The first-terminal tip portion is located below the first-terminal base portion. The first-terminal tip portion includes a tip surface exposed from the metal layer, and a recessed surface covered with the metal layer.