A substrate processing method includes: receiving, by a transfer arm, a substrate from a batch processing section in which a plurality of substrates is collectively processed in a state where each of the plurality of substrates stands upright; disposing the substrate on a disposing unit including a pin, a first liquid film being formed on an upper surface of the substrate from a process in the batch processing section; supplying a pure water toward the upper surface of the substrate, thereby forming a second liquid film of the pure water on the upper surface of the substrate; stop supplying the pure water and maintaining the second liquid film on the upper surface of the substrate for a predetermined time, and transporting the substrate to a single wafer processing section in which the plurality of substrates are processed one by one in a horizontal state.

There is provided a substrate processing apparatus with improved throughput by reconsidering a configuration of an apparatus including a batch type module and a single wafer type module. In a single wafer processing region according to single wafer processing of a processing block of the present invention, a buffer unit to and from which both a first transfer mechanism HTR and a center robot can hand over and receive a substrate(s) is provided. Therefore, the first transfer mechanism can collectively hand over and receive processed substrates and unprocessed substrates via the buffer unit. Therefore, a potential of the first transfer mechanism is drawn out, and the substrate processing apparatus having a high throughput can be provided.

A shuttle including: at least one collet configured to support at least one semiconductor chip, a stage configured to detachably support the at least one collet, and a rotational driving mechanism configured to rotate the stage in a first direction, the first direction being an axial direction, the at least one collet including, a support body configured to support the at least one semiconductor chip, and a ferromagnetic body on one side of the support body, and the stage including, a stage body including at least one detachment surface from which the at least one collet detaches, the detachment surface facing in a direction perpendicular to the first direction, and at least one electromagnet on the stage body, the at least one electromagnet configured to attach to or detach from the ferromagnetic body.

A substrate treating apparatus includes a batch-type processing unit configured to perform treatment on a plurality of substrates, a single-wafer-type processing unit configured to perform treatment on one substrate of the substrates at a time, a posture turning unit configured to turn and change the orientation of the substrates to be processed by the batch-type processing unit, while the substrates are wetted with deionized water, a first transport unit that transports the substrates, processed by the batch-type processing unit, to the posture turning unit, a second transport unit that transports the substrates turned horizontally by the posture turning unit to enable them to be subjected to treatment with the hand unit and a cleaning and drying unit configured to perform cleaning and drying treatment at the hand unit.

Disclosed is a substrate treating apparatus provided with a posture turning unit. The posture turning unit includes a first vertical holder having a first rotating member and a first holder body provided so as to protrude from the first rotating member. The posture turning unit also includes a second vertical holder having a second rotating member and a second holder body provided so as to protrude from the second rotating member. A rotation driving unit rotates the two holder bodies around the two rotating members, respectively, whereby the two vertical holders are changed into a holding state or a releasing state. When a posture of substrates is turned to horizontal by a support base rotator, the rotation driving unit changes a state of the two vertical holders into the releasing state, whereby the substrates are released from the two holder bodies.

In a substrate processing apparatus, an orientation converting area is provided between a transfer block and a batch processing area; a single-wafer transporting area is positioned adjacently to the transfer block and the orientation converting area; and the single-wafer processing area is positioned adjacently to the single-wafer transporting area. A center robot in the single-wafer transporting area transports the substrate from the second orientation converting mechanism in the orientation converting area, to the single-wafer processing chambers in the single-wafer processing area, and to the buffering unit. The center robot includes a horizontally movable hand that holds a substrate in a horizontal orientation, and a lifting stage that raises and lowers the hand, and the lifting stage has a fixed position in the horizontal direction.

The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a treating bath having an accommodation space for accommodating a treating liquid; a support member configured to support at least one substrate in a vertical posture at the accommodation space; and a posture changing robot configured to change a posture of a substrate immersed in the treating liquid from the vertical posture to a horizontal posture, and wherein the posture changing robot comprises: a body configured to hold the substrate thereon; and a liquid supply member configured to supply a wetting liquid to the substrate placed on the body.

There is provided a substrate processing apparatus in which throughput is improved by increasing the number of disposed single wafer type chambers while suppressing the size of the apparatus. According to the present invention, the single wafer type chambers can be stacked in a vertical direction, it is possible to provide a substrate processing apparatus in which more single wafer type chambers are mounted even in the same floor area as that of a conventional apparatus. Further, when a mechanism for carrying a substrate W into a single wafer type chamber (drying chamber) and a mechanism for carrying the substrate W out of the drying chamber are provided independently, the substrate can be smoothly transferred around the drying chamber. According to the present invention, it is possible to provide a substrate processing apparatus 1 having a small size and a high throughput.

Disclosed is a substrate treating apparatus provided with a treating block. The treating block includes a wet transportation region adjoining a batch treatment region and a single-wafer transportation region. The wet transportation region contains a second posture turning mechanism provided on an extension line of a line of six batch process tanks and configured to turn a posture of substrates, on which immersion treatment is performed, from vertical to horizontal, a belt conveyor mechanism configured to receive the substrates in a horizontal posture one by one from the second posture turning mechanism and transport the substrates to the single-wafer transportation region, and a liquid supplying unit configured to supply a liquid to wet the substrates, transported by the belt conveyor mechanism, with the liquid.

There is provided a substrate processing apparatus with improved throughput by reconsidering a configuration of an apparatus including a batch type module and a single wafer type module. In a single wafer processing region according to single wafer processing of a processing block of the present invention, a buffer unit to and from which both a first transfer mechanism and a center robot can hand over and receive a substrate(s) is provided. Therefore, the first transfer mechanism can collectively hand over and receive processed substrates and unprocessed substrates via the buffer unit. Therefore, a potential of the first transfer mechanism is drawn out, and the substrate processing apparatus having a high throughput can be provided.