The semiconductor device includes a semiconductor element, a conductive support member and a sealing resin whose resin side surface faces one side of a first direction. The support member has an outer lead including a root portion extending from the resin side surface, a mount portion on one side of a thickness direction relative to the root portion, and an extended portion connected to the root portion via a bent portion and to the mount portion via another bent portion. The outer lead has a first division including the extended portion, a second division including the root portion and connected to the first division, and a third division including the mount portion and connected to the first division. The first division is greater in second-direction dimension than the second and third divisions. A division boundary between the first and the third divisions is at the extended portion.

A semiconductor device includes a semiconductor element, a first lead, and a sealing resin. The first lead includes a die pad portion including a first lead reverse surface, and a first terminal portion. The sealing resin includes a second resin surface facing in a z direction and a third resin surface facing in an x direction. The first lead includes a metal layer. The first lead reverse surface is exposed from the second resin surface. The first terminal portion includes a first-terminal base portion and a first-terminal tip portion. The first-terminal base portion passes through the third resin surface, and is spaced apart from a first resin surface in the z direction. The first-terminal tip portion is located below the first-terminal base portion. The first-terminal tip portion includes a tip surface exposed from the metal layer, and a recessed surface covered with the metal layer.

A semiconductor device includes a semiconductor element, and a first terminal that is positioned on a first side in a first direction from the semiconductor element and electrically connected to the semiconductor element. In the first direction, a first channel is provided between the semiconductor element and the first terminal. The semiconductor element is in contact with the first channel. In one example, the semiconductor device additionally includes a first conductive member that is electrically connected to the semiconductor element and the first terminal. The first conductive member is contained in the first channel.

A semiconductor device having an improved bonding reliability of wire bonding is provided. The semiconductor device includes a semiconductor chip, a die pad, an inner lead, and a bonding wire. The semiconductor chip has a first lower surface, and a bonding pad provided on a first upper surface. The bonding pad has a second upper surface. The die pad has a third upper surface. The inner lead has a fourth upper surface. The semiconductor chip is mounted on the die pad such that the first lower surface faces the third upper surface. The bonding pad and the inner lead are electrically connected to each other via the bonding wire. In cross-sectional view, the second upper surface, to which the bonding wire is connected, of the bonding pad is located at the same height as the fourth upper surface, to which the bonding wire is connected, of the inner lead.

An electronic device includes a lead with a first portion that extends outward from a package structure and is coated with a dielectric film that extends to the side of the package structure, and an uncoated second portion that extends from the first portion to an end of the lead. A method includes forming a package structure to enclose an interior portion of a lead structure and coating an exterior first portion of the lead structure with a dielectric film that extends to a side of the package structure and leaving an exterior second portion of the lead structure uncoated.

In some embodiments, the present application provides an integrated circuit (IC) structure. The IC structure includes one or more electronic devices. An outer structure is adjacent to the IC chip. The outer structure comprises a first region adjacent to a first surface of the IC chip. The first region comprises a first shielding segment and a second shielding segment having a surface facing and offset from a surface of the first shielding segment.

A semiconductor module includes a semiconductor chip, a resin molded part, and a connection terminal electrically connected to the semiconductor chip. The connection terminal includes an internal terminal sealed in the resin molded part, an external terminal, and a tie bar remaining portion. The internal terminal is extended in a first direction and exposed from an opening portion of the resin molded part. The external terminal is connected to the internal terminal through the opening portion, and projected outside the resin molded part. The tie bar remaining portion extends from the internal terminal in a second direction intersecting the first direction and projects outside the resin molded part to provide a tie bar projecting portion. The connection terminal has a groove portion covered with the resin molded part, between an exposed portion of the internal terminal and the tie bar projecting portion.

A semiconductor device includes a conductive support member with first and second die pads, a first semiconductor element on the first die pad, a second semiconductor element on the second die pad for forming a first output-side circuit, and a sealing resin. The first semiconductor element includes a circuit part forming an input-side circuit, and an insulating part that transmits a signal between the input-side and the first output-side circuits, while providing electrical insulation between the input-side and the first output-side circuits. The sealing resin includes first and second side faces spaced apart in an x direction and a third side face perpendicular to a y direction. The conductive support member includes input-side terminals protruding from the first side face and first output-side terminals protruding from the second side face. The conductive support member is not exposed on the third side face.