It is possible to economically and safely operate an apparatus by allowing wafers made of different materials to be accommodated together. There is provided a technique that includes: a mapping apparatus configured to determine a material of a substrate accommodated in a carrier and loaded into the substrate processing apparatus; and a controller configured to be capable of updating and holding first information on the material of the substrate loaded into the substrate processing apparatus, and capable of controlling the substrate processing apparatus to take out the carrier accommodating the substrate when the first information on the material of the substrate does not satisfy a predetermined condition specified for a current operation mode among conditions specified respectively for a plurality of operation modes.

A system for wafer pairing for wafer-to-wafer bonding may include a wafer shape metrology sub-system and controller. The controller may receive the shape measurements for a set of top wafers and bottom wafers and then sort the set of top wafers and the bottom wafers into wafer groups based on the shape measurements. The controller may tag each top and bottom wafer with a wafer group number and determine wafer pairs from selected wafer groups. The controller may calculate the bow difference for each wafer pair of the set of wafer pairs and sort the set of wafer pairs into wafer pair groups based on intervals of bow difference. The controller may associate each wafer pair group with a corresponding reference recipe and direct a bonder to bond the wafer pairs in a selected wafer pair group according to a corresponding reference recipe associated with the selected wafer pair group.

There is provided a technique that includes: a plurality of light emitters arranged to be capable of emitting reference light onto each of a plurality of substrates arranged at a predetermined interval; a plurality of light receivers disposed to face the plurality of light emitters, each of the plurality of light receivers being capable of detecting light transmitted through a corresponding substrate among the plurality of substrates; a driver configured to relatively move the plurality of substrates so that the plurality of substrates pass through a plurality of optical axes connecting the plurality of light emitters and the corresponding plurality of light receivers respectively; a determiner configured to perform a predetermined determination based on a light reception intensity of each of the plurality of light receivers; and a discriminator configured to discriminate a material of each of the plurality of substrates based on a determination result from the determiner.