A bonding and indexing method is provided, having a first index head to move a substrate in an indexing direction from a first position to a second position; a second index head to move the substrate in an indexing direction from the second position to a third position; and the first and/or second index head has a bonding element to effect a bonding process between the substrate and an element disposed against the substrate so that bonding and movement in the indexing direction is implemented simultaneously by the first index head and/or bonding and movement in the indexing direction is implemented simultaneously by the second index head.

An interconnect structure includes a plurality of first pads, a plurality of second pads, and a plurality of conductive lines. The first pads are arranged to form a first column-and-row array, and the second pads are arranged to form a second column-and-row array. The first column-and-row array, the second column-and-row array and the conductive lines are disposed in a same layer. The first pads in adjacent rows in the first column-and-row array are separated from each other by a first vertical distance from a plan view, the second pads in adjacent rows in the second column-and-row array are separated from each other by a second vertical distance from the plan view. A sum of widths of the conductive lines electrically connecting the first pads and the second pads in the same row is less than the first vertical distance and the second vertical distance from the plan view.

Provided is an electronic component including a pad region including a plurality of pads extending along corresponding extension lines and arranged in a first direction, and a signal wire configured to receive a driving signal from the pad region, wherein the plurality of pads include a plurality of first pads arranged continuously and a plurality of second pads arranged continuously, and extension lines of the plurality of first pads substantially converge into a first point and extension lines of the plurality of second pads substantially converge into a second point different from the first point.