A fixture, for example, comprised in a semiconductor processing system, includes a standoff arranged for fixation relative to a reaction chamber of a semiconductor processing system. A slide member is slidably supported by the standoff and is translatable along a carrying axis extending into the reaction chamber. A male threaded member depends from the slide member and is rotatable about a seating axis that is angled relative to the carrying axis. A paddle member depends from the male threaded member, defines along the carrying axis, is fixed relative to slide member along the carrying axis to carry a component of a process kit into the reaction chamber using translation of the slide member, and is free relative to the slide member along the seating axis to seat the process kit component within the reaction chamber using rotation of the male threaded member.

A substrate processing system includes a substrate processing apparatus configured to process a substrate, a substrate transfer mechanism including a substrate holder configured to hold the substrate, an imaging device provided in the substrate transfer mechanism and configured to image a monitoring target member inside the substrate processing apparatus, and a controller. The controller is configured to cause the imaging device to image multiple portions of the monitoring target member, including a central portion facing a center of the substrate during processing and a peripheral edge portion facing a peripheral edge side of the substrate during the processing, by moving the substrate holder, and calculate, for each of the multiple portions of the monitoring target member, a physical amount indicating a state of the corresponding portion based on an imaging result.

A first transfer device and a second transfer device are configured to transfer a first substrate and a second substrate in a normal pressure atmosphere. A third transfer device is configured to transfer the first substrate and the second substrate in a decompressed atmosphere. A load lock chamber has accommodation sections allowed to accommodate therein the first substrate and the second substrate, and is allowed to switch an inside of the accommodation sections between the normal pressure atmosphere and the decompressed atmosphere. Multiple gates are respectively disposed on three different sides of the load lock chamber, and allowed to open or close the load lock chamber. The first transfer device, the second transfer device, and the third transfer device carry the first substrate and the second substrate into/out of the load lock chamber through different gates among the multiple gates.