A discrete power semiconductor package includes a semiconductor chip, a heatsink, a first lead, a second lead, and a clip. The heatsink is adjacent the semiconductor chip and draws heat away from the semiconductor chip. The clip binds the semiconductor chip to the heatsink and includes a chip linker, a first terminal, and a second terminal. The chip linker is atop the semiconductor chip. The first terminal connects to the first lead and the second terminal connects to the second lead.

A power module includes: a first substrate having an outer surface and an inner surface; a semiconductor die coupled to the inner surface of the first substrate; a second substrate having an outer surface and an inner surface, the semiconductor die being coupled to the inner surface of the second substrate; and a flex circuit coupled to the semiconductor die.

An apparatus for retrofitting a HID lighting system includes using existing components of previously installed HID lighting systems such as its ballasts while replacing some capacitors to adjust the power supplied to a retrofit LED luminaire. Unused ballast drivers are removed, and a self-contained ballast driver assembly is mounted into the electronic control enclosure of the previously installed lighting system. Some of the retrofit LED luminaires include an uplighting lens, an optic, or a diffuser for providing uplight. An aiming bracket and an aiming plate allow for the horizontal aiming angle of a light luminaire to be set.

A fixing system for fixing a liquid cooling block on a heat-generating electronic component, the fixing system comprising a mounting bracket and an indicator. The mounting bracket comprises a main portion overlying at least part of the liquid cooling block in order to urge the liquid cooling block against the heat-generating electronic component, and an outer connecting portion extending from the main portion and configured to be fastened to a substrate on which the heat-generating electronic component is disposed. The indicator is disposed between the main portion and the liquid cooling block, and undergoes deformation in response to the outer connecting portion being progressively fastened to the substrate in order to provide an indication to a user that a desired amount of pressure is exerted between the mounting bracket and the liquid cooling block for establishing adequate contact between the liquid cooling block and the heat-generating electronic component.

An apparatus for retrofitting a HID lighting system with LED fixtures includes an aiming device for aiming the retrofit LED fixtures, a snout for spacing the retrofit LED fixtures away from a possibly interfering structure, and an extended knuckle for spacing the retrofit LED fixtures away from a possibly interfering structure.

A multi-stage, spring-loaded fastener assembly comprises a spring-loaded fastener and a fastener cap. The spring-loaded fastener includes a fastener head, a fastener body that extends from the fastener head to a distal end, a pressure plate, and a compression spring disposed between the fastener head and the pressure plate and operatively coupled to the pressure plate to assert a force on the pressure plate in a first direction. The fastener cap comprises a head portion and a body portion. The fastener cap is coupled to the fastener head of the spring-loaded fastener. The body portion extends toward the pressure plate and is operatively coupled to the pressure plate to resist movement of the pressure plate in a second direction that is opposite to the first direction.

A semiconductor package comprises a semiconductor transistor die, an encapsulant embedding the semiconductor transistor die, and two fastening devices for fastening the semiconductor package to a heat sink, each one of the fastening devices comprising an upper portion which is partly embedded in the encapsulant, and a lower portion connected with the horizontal holding portion.