A method of forming a semiconductor package includes providing a semiconductor die that includes a bond pad disposed at an upper side of the semiconductor die, providing a carrier that includes a die attach pad and a landing pad, mounting the semiconductor die on the die attach pad with the bond pad facing away from the carrier, and attaching an electrical interconnect element between the bond pad and the landing pad, wherein the bond pad is formed from nanowires.

Aspects of the disclosure advantageously provide one or more methods of improving microelectronic production by mitigating obstructions via strategic placement of wire bond stud bumps. A microelectronic assembly and a method of producing the same are provided. The method includes placing a set of stud bumps on a substrate defining a boundary of a location for placement of a component, wherein the set of stud bumps comprises a first stud bump and a second stud bump, the first stud bump comprising a greater amount of wire bonding material than the second stud bump; placing the component at the location on the substrate via a layer of a binding material; and forming a wire bond between the component and the first stud bump. In one or more embodiments, a microelectronic assembly is produced in accordance with the method described above.

In examples, a package comprises a semiconductor die having a device side and a bond pad on the device side, a conductive terminal exposed to an exterior of the package, and an electrical fuse. The electrical fuse comprises a conductive ball coupled to the bond pad, and a bond wire coupled to the conductive terminal. The bond wire is stitch-bonded to the conductive ball.

A semiconductor device includes a mounting substrate having a first surface, a semiconductor chip mounted on the first surface and having a second surface facing a side opposite to the first surface, and a wire extending from a first joint point on the first surface toward a second joint point on the second surface and electrically connecting the mounting substrate and the semiconductor chip to each other by connecting the first joint point and the second joint point to each other. The wire includes a first part, a first bent portion, a second part, a second bent portion, and a third part arranged in order from the first joint point toward the second joint point. The first part is positioned on the first surface side with respect to the second surface when viewed in a first direction along the first surface and the second surface.