A package structure includes a redistribution structure, a die and an underfill layer. The redistribution structure includes a first insulating layer, a second insulating layer, a first redistribution layer and a first alignment mark. The first redistribution layer and the first alignment mark are located between the first insulating layer and the second insulating layer. The die is attached to the redistribution structure. The second insulating layer includes a trench laterally located between the first alignment mark and the die. The underfill layer is located between the redistribution structure and the die. A portion of the underfill layer is filled in the trench.

A semiconductor device and methods of forming the same. In some embodiments, a method for forming a semiconductor device includes forming a redistribution layer that includes connecting vias and a surface mount pad via and the top surface width of each via is larger than a bottom surface width. The method includes connecting a component to the redistribution layer by a plurality of -bumps and filling a gap between the component and the redistribution layer with a mold and an underfill. The method includes etching back the redistribution layer to expose the surface mount pad via and attaching a surface mount pad to the surface mount pad via. The surface mount pad is connected to the bottom surface width of the surface mount pad via and the surface mount pad includes a protrude. The method includes connecting a device to a bottom surface of the surface mount pad.

Provided is a package structure, which includes a substrate, an interposer module, and a chip module. The interposer module is disposed on the substrate. The interposer module includes a first insulating layer, a second insulating layer, and multiple dummy terminals. The first insulating layer is disposed between the second insulating layer and the substrate. The multiple dummy terminals are in direct contact with the first insulating layer and the substrate. The chip module is disposed on the interposer module and is electrically connected to the substrate through the interposer module. Also provided is a manufacturing method of a package structure. The plurality of external terminals include a plurality of functional components. The substrate is disposed between the plurality of dummy terminals and the plurality of external terminals, and the plurality of dummy terminals are electrically insulated the plurality of functional components.

A method for manufacturing an electronic device includes steps as follows. A substrate is provided. A first mask is provided on a first surface of the substrate. The first mask is patterned to form a first opening in the first mask, and the first opening exposes a corresponding portion of the substrate. A light source including a first energy is provided to the corresponding portion of the substrate to perform a first modification step, so as to form a first modified region in the substrate. Another light source including a second energy is provided to the corresponding portion of the substrate to perform a second modification step, so as to form a second modified region in the substrate. The second modified region at least partially overlaps the first modified region.