A semiconductor device includes: a first semiconductor chip and a second semiconductor chip each including a first main electrode on a bottom surface side and a second main electrode on a top surface side; a conductive member provided to electrically connect the first main electrode of the first semiconductor chip to the second main electrode of the second semiconductor chip; a first external terminal electrically connected to the second main electrode of the first semiconductor chip and partly opposed to the conductive member, and a resin member provided to be at least partly arranged between the conductive member and the first external terminal.

An electronic device includes a lead with a first portion that extends outward from a package structure and is coated with a dielectric film that extends to the side of the package structure, and an uncoated second portion that extends from the first portion to an end of the lead. A method includes forming a package structure to enclose an interior portion of a lead structure and coating an exterior first portion of the lead structure with a dielectric film that extends to a side of the package structure and leaving an exterior second portion of the lead structure uncoated.