An underfill dispensing system includes a substrate table configured to support a substrate including a plurality of bonding areas for mounting a plurality of semiconductor chips, a heating structure disposed on an upper surface of the substrate table and including a plurality of heating blocks, a dispensing head configured to dispense underfill to a plurality of bonding areas of the substrate, above the substrate table, an imaging device, and a control unit configured to control the heating structure and the dispensing head. The imaging device is configured to image at least one of the substrate and the plurality of semiconductor chips to generate an image. The controller is configured to control the plurality of heating blocks independently of one another based on the image.

A method of dispensing an underfill material on a semiconductor device package. A substrate having a semiconductor chip electrically connected thereto and offset from the substrate by solder joints is provided. The semiconductor chip has a footprint defined by a length and width of the semiconductor chip. Standoff heights between the substrate and the semiconductor chip are calculated and used to determine a volume of underfill material needed to substantially fill a space between the substrate and the semiconductor chip. The determined volume of underfill material is dispensed on the substrate such that the space between the substrate and the semiconductor chip is substantially filled by the underfill material. The method may allow for improved dispensing an underfill material to substantially fill the space between the substrate and semiconductor chip when variations in standoff height are present.

A wire feeder includes a cartridge disposed in a supply position and having a wire spool wound with a wire, and including an outlet portion through which the wire is drawn outwardly along an internal travel path, an air guide disposed on a wire supply path and including a first inlet portion through which the wire drawn out from the outlet portion is drawn in, wherein the first inlet portion is aligned with the outlet portion on the wire supply path, a sensor disposed at the first inlet portion of the air guide, and a first vacuum line generating a vacuum in an interior of the first inlet portion according to a detection of the wire at the first inlet by the sensor.

Thermocompression bonding head fixture designs and techniques for use thereof are provided. In one aspect, an exemplary bonding head fixture includes: a workpiece contact surface; at least one recess in the workpiece contact surface; and heat passages leading into and out of the at least one recess. In another aspect, an exemplary bonding head includes: a bonding head fixture having a workpiece contact surface, at least one recess in the workpiece contact surface, and heat passages leading into and out of the at least one recess; and a heat source connected to at least one of the heat passages. Methods for use of the present bonding head fixtures are also provided.

A wire bonding apparatus may include a wire supply portion configured to supply a conductive wire, a capillary configured to draw out the conductive wire supplied from the wire supply portion, and a wire holder disposed between the capillary and the wire supply portion. The wire holder has a first clamp and a second clamp that are spaced apart from each other and are configured to clamp the conductive wire. Each of the first clamp and the second clamp has a polygonal column shaped support body having with a plurality of contact surfaces along a circumference of each of the first clamp and the second clamp, and the polygonal column shaped support body is configured to rotate in a circumferential direction about a central axis of the polygonal column shaped support body.