A semiconductor device includes: a wiring board having a surface; a chip stack disposed above the surface and including a first semiconductor chip; a second semiconductor chip disposed between the surface and the chip stack; a spacer disposed between the surface and the first semiconductor chip, the spacer surrounding the second semiconductor chip along the surface, and the spacer containing a material higher in thermal conductivity than silicon; and a sealing insulation layer covering the chip stack.

According to one embodiment, a method of manufacturing a semiconductor device includes forming a plurality of stacked bodies on a substrate, each of the stacked bodies includes a plurality of semiconductor chips. The method further includes forming a plurality of first wires on the stacked bodies. The first wires connecting the stacked bodies to each other. The method further includes forming a resin layer on the stacked bodies and the first wires, then thinning he resin layer until the first wires are exposed.

Disclosed is a microelectronic device assembly comprising a substrate having conductors exposed on a surface thereof. Two or more microelectronic devices are stacked on the substrate and the components are connected with conductive material in preformed holes in dielectric material in the bond lines aligned with TSVs of the devices and the exposed conductors of the substrate. Methods of fabrication are also disclosed.

A camera module includes a housing configured to accommodate a lens barrel; a first circuit board, disposed below the housing, including a first ground pad; a shield cover configured to cover the housing; a second circuit board, disposed on one side surface of the housing, including a second ground pad corresponding to the first ground pad; a first solder connecting the first ground pad and the second ground pad; and a second solder connecting the shield cover and the second ground pad. The second ground pad comprises a first connection part connected to the first ground pad through the first solder and a second connection part connected to the shield cover through the second solder.