A semiconductor structure includes a front-end-of-line level including a plurality of field effect transistors electrically connected to a back-end-of-line interconnect level located on a first side of the front-end-of-line level. A plurality of shallow trench isolation regions are located between adjacent field effect transistors, each of the plurality of shallow trench isolation regions being surrounded by a dielectric isolation liner. A backside power rail is located within a backside interlayer dielectric located on a second side of the front-end-of-line level opposing the first side of the front-end-of-line level. A via-to-backside power rail embedded, at least in part, within a shallow trench isolation region is located between two field effect transistors of a similar polarity, the via-to-backside power rail is adjacent and electrically connected to at least one metal contact and extends from the at least one metal contact to a first surface of the backside power rail.

According to the embodiment of the present invention, a semiconductor device includes a first nanodevice comprised of a plurality of first transistors and a second nanodevice comprised of a plurality of second transistors. The first nanodevice includes a first source/drain contact. The second nanodevice includes a second source/drain contact. The second nanodevice is located adjacent to and parallel to the first nanodevice. A power bar is located between the first nanodevice and the second nanodevice. The power bar is connected to the second source/drain contact. A top surface of the power bar and the second source/drain contact are substantially in a same plane. The top surface of the power bar and the second source/drain contact are substantially a same height.

Power distribution fabrics and methods of forming the same include forming a first layer of parallel conductive lines, having a first width. At least one additional layer of conductive lines is formed over the first layer of conductive lines, with the conductive lines of each successive layer in the at least one additional layer having a different orientation and a different width relative to the conductive lines of the preceding layer.

A semiconductor structure and a manufacturing method thereof are provided. A semiconductor structure includes a first nitride-containing layer on a side of a carrier substrate, first semiconductor devices thermally coupled to the first nitride-containing layer, a first interconnect structure physically and electrically coupled to first sides of the first semiconductor devices, and a first metal-containing dielectric layer bonding the first nitride-containing layer to the first interconnect structure. A thermal conductivity of the first nitride-containing layer is greater than a thermal conductivity of the first metal-containing dielectric layer.

A semiconductor device includes a semiconductor substrate having a top surface and a bottom surface. An electronic device is integrated into the top surface of the semiconductor substrate. A conductive power rail is positioned intermediate the top surface and the bottom surface of the semiconductor substrate. The conductive power rail is configured to conduct power to the electronic device.

Embodiments of present invention provide a semiconductor structure. The structure includes a device die including a device layer; a back-end-of-line (BEOL) structure on a frontside of the device layer and a frontside substrate attached to the BEOL structure; and a backside power distribution network (BSPDN) structure on a backside of the device layer and a backside substrate attached to the BSPDN structure; and a device package including a base element and a lid element, wherein the device die is attached to the base element of the device package through multiple C4 bumps at the frontside substrate and is attached to the lid element of the device package at the backside substrate. A method of forming the same is also provided.

Embodiments described herein may be related to apparatuses, processes, and techniques related to patterning and metallization to produce metal features on a substrate that have pitches less than 26 nm. Other embodiments may be described and/or claimed.

A semiconductor device includes a source/drain component of a transistor. A source/drain contact is disposed over the source/drain component. A source/drain via is disposed over the source/drain contact. The source/drain via contains copper. A first liner at least partially surrounds the source/drain via. A second liner at least partially surrounds the first liner. The first liner and the second liner are disposed between the source/drain contact and the source/drain via. The first liner and the second liner have different material compositions.

A semiconductor processing system includes a layout database that stores a plurality of layouts indicating features to be formed in a wafer. The semiconductor processing system includes a layout analyzer that analyzes the layouts and determines, for each layout, whether a non-perpendicular particle bombardment process should be utilized in conjunction with a photolithography process for forming the features of the layout in a wafer.

A semiconductor device including a first source/drain region (S/D) located on a frontside of a substrate, wherein the first source/drain region has a first width, a second S/D region located on the frontside of the substrate, wherein the second source/drain region is located above the first source drain region, wherein the second source/drain region has second width, wherein the first width is larger than the second width, a first power rail located on a backside of the substrate, a second power rail located on the backside of the substrate, a first connector in contact with the first source/drain region, wherein the first connector is only in contact with a sidewall of the first source/drain region, and a second connector in contact with the second source/drain region, wherein the second connector is in contact with a top surface and a side surface of the second source/drain region.