A cleaning system includes at least one cleaning module configured to receive a substrate after a chemical mechanical polishing (CMP) process and to remove contaminants on the substrate using a cleaning solution. The cleaning system further includes a cleaning solution supply system configured to supply the cleaning solution to the at least one cleaning module. The cleaning solution supply system includes at least one temperature control system. The at least one temperature control system includes a heating device configured to heat the cleaning solution, a cooling device configured to cool the cleaning solution, a temperature sensor configured to monitor a temperature of the cleaning solution, and a temperature controller configured to control the heating device and the cooling device.

A brush includes a body, and a plurality of nodules disposed on at least one surface of the body and at least partially protruding outward from the body. The plurality of nodules include a plurality of first nodules. Each nodule of the plurality of first nodules includes a housing including an open side and an accommodating space, and a rotating ball including a portion accommodated inside the accommodating space of the housing and a remaining portion exposed to an outside of the housing. The rotating ball is rotatable.

A substrate processing apparatus may include: a substrate including a first face and a second face that are opposite to each other; a substrate driver configured to come into contact with a peripheral part of the substrate, and provide a driving force to the substrate to rotate the substrate; a first brush that faces the first face, and is configured to clean the first face by coming into contact with the first face and rotating in a first direction; a second brush that faces the second face, and is configured to clean the second face by coming into contact with the second face and rotating in the first direction; and a controller configured to control at least one from among the substrate driver, the first brush, and the second brush.

Provided is a substrate cleaning brush and a substrate cleaning apparatus including same. The substrate cleaning brush includes: a core portion having a cylindrical shape; a brush on the core portion, the brush including a center region and edge regions, wherein the edge regions are on opposite side of the center region; and a plurality of protruding portions on the brush, wherein a protrusion ratio of the plurality of protruding portions increases linearly from the center region to the edge regions, and wherein a width of a bottom level of at least one of the plurality of protruding portions is larger than a width of a top level of the at least one of the plurality of protruding portions.

A method includes the following steps. A wafer table is cleaned by using a cleaning scrubber. After cleaning the wafer table, a semiconductor wafer is loaded onto the wafer table. After loading the semiconductor wafer onto the wafer table, a photolithography process is performed on the semiconductor wafer. The cleaning scrubber has microstructures protruding from a surface of the cleaning scrubber. The microstructures are spaced apart from each other and have a tapered width. The microstructures are diamond microstructures. The surface of the cleaning scrubber includes an inner annular region and an outer annular region around the inner annular region. first ones of the plurality of microstructures within the outer annular region have a height different from a height of second ones of the plurality of microstructure within the inner annular region.

A substrate cleaning device (31) includes a roll cleaning member (61) and a rotation holding portion (100). The rotation holding portion (100) includes a non-contact sealing portion (140) that is disposed between a bearing portion (130) and the roll cleaning member (61) to seal a gap between a shaft portion (110) and a housing portion (120). The non-contact sealing portion (140) includes a rotating portion (150) that is attached to the shaft portion (110) and has a plurality of protrusion portions (151) formed on a peripheral surface (150a) of the rotating portion (150) at intervals in an axial direction, and a fixed portion (160) that is attached to the housing portion (120), surrounds the plurality of protrusion portions (151), and has a gas supply hole (161) formed in an inner peripheral surface (160a) of the fixed portion (160) surrounding the plurality of protrusion portions (151), the gas supply hole (161) supplying a compressed gas (200) from a position inward of the protrusion portions (151) in the axial direction, which are disposed at both end portions in the axial direction, among the plurality of protrusion portions (151).

Provided is a method for cleaning a wafer that enables sufficient removal of cutting chips from the wafer surface. The method for cleaning a wafer includes: mounting a wafer 56 on a spinner table 4 such that a rear surface of the wafer 56 faces the spinner table 4 and a front surface 56a of the wafer 56 is exposed, the spinner table 4 being rotatable while holding the wafer 56; subjecting the front surface 56a of the wafer 56 to first cleaning with cleaning water supplied to the front surface 56a of the wafer 56, while rotating the spinner table 4; and subjecting the front surface 56a of the wafer 56 to second cleaning with ammonia water supplied to the front surface 56a of the wafer 56 using a brush. [Elected View] FIG. 6

A substrate processing system includes a protective film forming liquid supplying unit which supplies a protective film forming liquid to one surface of a substrate, a protective film forming unit which solidifies or hardens the protective film forming liquid and forms a protective film on the one surface of the substrate, a suction unit which suctions the one surface of the substrate, a processing unit which executes predetermined processing with respect to the other surface of the substrate in a state that the one surface of the substrate is suctioned by the suction unit, and a removing liquid supplying unit which has a removing liquid discharge port that discharges a removing liquid being capable of removing the protective film and supplies the removing liquid toward the one surface of the substrate from the removing liquid discharge port.

An apparatus is provided. The apparatus includes a wafer support assembly configured to support a semiconductor wafer in a cleaning position. The apparatus includes a wafer cleaning assembly configured to apply a fluid including hydrogen to the semiconductor wafer while the semiconductor wafer is in the cleaning position.

A cleaning brush for a semiconductor fabrication process is provided. The cleaning brush includes a core and a brush member. The core includes a circumferential portion and a closed end portion. The circumferential portion surrounds a rotation axis of the cleaning brush and defines an inlet opening for receiving a fluid. The closed end portion is connected to an end of the circumferential portion that is opposite to the inlet opening along the rotation axis. At least one elongated conduit is defined within the core and fluidly communicated with the inlet opening, and the circumferential portion includes a plurality of outlet channels passing therethrough to fluidly communicate with the elongated conduit, the outlet channels being tilted outwardly toward the closed end portion. The brush member is connected to an outer surface of the circumferential portion and covers all of the outlet channels.