A semiconductor device includes: a first semiconductor chip and a second semiconductor chip each including a first main electrode on a bottom surface side and a second main electrode on a top surface side; a conductive member provided to electrically connect the first main electrode of the first semiconductor chip to the second main electrode of the second semiconductor chip; a first external terminal electrically connected to the second main electrode of the first semiconductor chip and partly opposed to the conductive member, and a resin member provided to be at least partly arranged between the conductive member and the first external terminal.

A semiconductor device includes an insulating substrate, a plurality of semiconductor elements, a gate terminal, a printed circuit board and a passive component. The insulating substrate has a wiring. Each of the plurality of semiconductor elements has a first main electrode disposed on a first surface, a second main electrode disposed on a second surface opposite to the first surface, and a gate pad disposed on the second surface. The first main electrodes of the plurality of semiconductor elements are commonly connected to the wiring. The printed circuit board provides a gate wiring that electrically relays the gate pad and the gate terminal. The passive component includes a ferrite bead or a balance resistor. The passive component is mounted on the printed circuit board to adjust an impedance of the gate wiring.