A semiconductor package includes a semiconductor die stack stacked in a staircase shape; a wiring structure facing one surface of the semiconductor die stack, the wiring structure including a conductive pad facing the semiconductor die stack; and a bonding wire connecting the semiconductor die stack to the conductive pad. The wiring structure includes a wiring structure upper surface facing the one surface of the semiconductor die stack, and a wiring structure lower surface that is opposite the wiring structure upper surface, and the wiring structure upper surface extends along a virtual plane. The conductive pad includes a conductive pad surface facing the one surface of the semiconductor die stack. The conductive pad surface is separated from the virtual plane.