A substrate processing apparatus includes a first substrate processing portion and a transfer mechanism. The first substrate processing portion processes substrates one by one by immersing each of the substrates in a vertical posture in a first processing liquid. The transfer mechanism receives the substrate in a horizontal posture, changes a posture of the substrate from the horizontal posture to the vertical posture, and carries the substrate in the vertical posture into the first substrate processing portion. The first substrate processing portion includes a processing bath and a substrate placement mechanism. The processing bath has a capacity corresponding to a single substrate. In the processing bath, only the single substrate in the vertical posture is disposed and the first processing liquid is stored. The substrate placement mechanism receives the substrate from the transfer mechanism and places only the single substrate in the vertical posture in the first processing liquid.

The present disclosure describes a semiconductor substrate processing system that places a semiconductor substrate in a process chamber using images captured by cameras positioned on the substrate. A controller for moving a semiconductor substrate includes a memory and a processor. The processor receives a first image from a first camera positioned on the semiconductor substrate and a second image from a second camera positioned on the semiconductor substrate. The first camera is different from the second camera. The processor also detects a first lift pin hole in the first image and a second lift pin hole in the second image, determines, based on a position of the first lift pin hole in the first image and a position of the second lift pin hole in the second image, an offset for the semiconductor substrate, and moves a robot holding the semiconductor substrate based on the offset.

There is provided a substrate processing apparatus comprising: a substrate transfer chamber having a floor provided with a first magnet; a substrate transfer module including a stage on which a substrate is placed, a traveling plate disposed below the stage, and a second magnet having a repulsive force with respect to the first magnet, the substrate transfer module being configured to be movable in the substrate transfer chamber by magnetic levitation using the repulsive force; and a substrate processing chamber disposed on an upper surface side of the substrate transfer chamber to process the substrate, the substrate processing chamber having an opening having a size that allows at least a part of the stage on which the substrate is placed to pass therethrough, the opening being open toward the inside of the substrate transfer chamber. The substrate is processed in a state where the stage on which the substrate is placed is inserted into the substrate processing chamber through the opening by raising the substrate transfer module and the opening is closed by the traveling plate.

There is provided a substrate processing apparatus comprising: a substrate transfer chamber having a floor provided with a first magnet; a substrate transfer module including a stage on which a substrate is placed, a traveling plate disposed below the stage, and a second magnet having a repulsive force with respect to the first magnet, the substrate transfer module being configured to be movable in the substrate transfer chamber by magnetic levitation using the repulsive force; and a substrate processing chamber disposed on an upper surface side of the substrate transfer chamber to process the substrate, the substrate processing chamber having an opening having a size that allows at least a part of the stage on which the substrate is placed to pass therethrough, the opening being open toward the inside of the substrate transfer chamber. The substrate is processed in a state where the stage on which the substrate is placed is inserted into the substrate processing chamber through the opening by raising the substrate transfer module and the opening is closed by the traveling plate.