A semiconductor arrangement is provided. The semiconductor arrangement includes a dielectric layer defining an opening, an adhesion layer in the opening, and a conductive layer in the opening over the adhesion layer. A material of the conductive layer is a same material as an adhesion material of the adhesion layer.

A light-emitting substrate and a manufacturing method thereof are provided. The reactivity of part of the ink layer outside the preset area that is far from the light with the first preset wavelength is improved by a heating process. Thus, the part of the ink layer reacts sufficiently under irradiation of the light with the first preset wavelength at lower energy. This improves an undercut issue caused by insufficient curing of the ink layer outside the preset area far from the light with the first preset wavelength, thereby preventing the ink layer from being peeled off from the light-emitting substrate.