A printed wiring board assembly is disclosed that includes a printed wiring board with a first side and a second side opposite first side. Magnet structures are in physical contact with the printed wiring board and a microelectronic device component is coupled to the first side of the printed wiring board. A heat spreader overlies and is in thermal communication with the microelectronic device component, and posts are coupled to the heat spreader and horizontally neighbor the microelectronic device component, where the posts are in magnetic communication with the magnet structures. Related methods and electronic systems are also disclosed.

A cooling device dissipates heat of an object to be cooled, and has a cooling fluid line for the passage of cooling fluid, base component which has one or more cooling fluid line portions of the cooling fluid line, and heat sink for absorbing waste heat from the object to be cooled and for transmitting the waste heat to cooling fluid. The heat sink is arranged on a cooling component of the cooling device which has at least one cooling fluid line portion and which, while connecting that cooling fluid line portion to a cooling fluid line portion of the base component, is movably connected to the base component, so that the cooling component and the base component can be moved relative to one another either toward one another or away from one another if required, in order to adjust the position of the heat sink of the cooling component.