A thermal dissipation system for an integrated circuit (IC) includes an IC disposed on a substrate and a heat sink including a body having a first surface including a first part coupled to a side of the IC opposite the substrate and a second part disposed away from the IC and positioned in spaced relation to the substrate. A set of legs support at least the second part of the body in spaced relation to the substrate. The set of legs may be part of the body or may be part of a carrier disposed between the second part of the first surface of the body and the substrate. The carrier includes an opening through which a portion of the substrate that includes the first part that is coupled to the side of the IC opposite the substrate extends.

A cooling package for an integrated circuit, including: package substrate of the integrated circuit having a first package surface, an enclosure and a thermal conductive material filling a gap between the substrate and a circuit die locatable therein and filling a gap between interior sidewalls of the enclosure and sidewall surfaces of the circuit die couplable to the first package surface. A method including: mounting an enclosure to the first package surface, the enclosure surrounding a location on the first package surface the circuit die is couplable thereto and the circuit die is locatable therein, and, filling the enclosure with the thermal conductive material such that the gaps are filled with the thermal conductive material. An integrated circuit cooling package including the substrate, first and second enclosures and first and second thermal conductive materials is also disclosed.