A device comprises a first substrate directly hybrid bonded to a second substrate. The first substrate comprises at least one first conductive feature on at least one optical device material stack disposed in a first dielectric layer. The second substrate comprises at least one second conductive feature disposed in a second dielectric layer. A thickness of the at least one first conductive feature is less than about 300 nm, and a thickness of the at least one optical device material stack is greater than about 2 microns.