A flip-chip bonding-based antenna packaging structure and its manufacturing method are provided. The flip-chip bonding-based antenna packaging structure includes a lead frame structure and a redistribution structure disposed above the lead frame structure. The redistribution structure includes a first surface and a second surface. The lead frame structure is disposed on the redistribution structure and includes a metal member, a first active element, and a passive element. The metal member includes a base portion, a first supporting portion on the base portion, and an extension portion adjacent to the first supporting portion. The extension portion extends from the base portion, and the first supporting portion is parallel to the extension portion. The first active element is disposed between the first supporting portion and the first surface. The passive element is disposed on the second surface and is electrically connected to the first active element.

A power device and method of making said power device. The device including a gate controller coupled to a first substrate. A first set of one or more transistor devices is coupled to a second substrate and a second set of one or more transistor devices is also coupled to the second substrate. The first set of transistor devices and second set of transistor devices are communicatively coupled to the gate controller.

A power device and method of making said power device. The device including a gate controller coupled to a first substrate. A first set of one or more transistor devices is coupled to a second substrate and a second set of one or more transistor devices is also coupled to the second substrate. The first set of transistor devices and second set of transistor devices are communicatively coupled to the gate controller.