A semiconductor module, including a semiconductor chip, a sealed main body portion sealing the semiconductor chip and having a pair of attachment holes penetrating therethrough, a heat dissipation plate in contact with the sealed main body portion. The heat dissipation plate is positioned between the attachment holes in a plan view of the semiconductor module. The semiconductor module further includes a pair of rear surface supporting portions and/or a pair of front surface supporting portions protruding respectively from rear and front surfaces of the sealed main body portion. In the plan view, the heat dissipation plate is formed between the pair of attachment holes, which are in turn between the pair of rear surface supporting portions. The pair of front surface supporting portions are formed substantially between the pair of attachment holes in the plan view.

Improved semiconductor chip package thermo-mechanical cooling assembly are disclosed. An example An apparatus includes: a bolster plate to be coupled to a back plate, the bolster plate and backplate to sandwich a circuit board therebetween; a loading plate including a first fixture, the first fixture to engage a load stud protruding from the bolster plate; and a heat sink base including a second fixture, the second fixture to engage a pin protruding from the loading plate.

A semiconductor package includes: a molded body having opposite first and second sides; at least one semiconductor die encapsulated by the molded body; and a die carrier having opposite first and second sides. The semiconductor die is arranged over the first side of the die carrier. The second side of the die carrier is at least partially exposed from the second side of the molded body, forming at least one exposed portion of the die carrier. The first side of the molded body includes a first portion protruding from a second portion in a vertical direction perpendicular to the first side, forming a planar surface. The second portion extends completely along at least one edge of the first side. A center point of the first portion is in vertical alignment with a center point of the exposed portion.

A display device includes: a circuit substrate including a plurality of pixel circuit units and a plurality of pads on a first surface thereof, the plurality of pads being electrically connected to the pixel circuit units; a display substrate on the circuit substrate and including a plurality of light emitting elements electrically connected to the pixel circuit units; a circuit board on the circuit substrate and including a plurality of circuit board pads electrically connected to the pads; a heat dissipation substrate on a second surface of the circuit substrate, the second surface being opposite to the first surface; and a cover substrate on the heat dissipation substrate and partially overlapping the circuit substrate and the circuit board. Each of the plurality of pads is in direct contact with at least one of the plurality of circuit board pads.