A recording element unit includes a first electrode pad, a second electrode pad, and a wire for electrically connecting the first electrode pad and the second electrode pad. The wire has a plurality of bending points at which the wire is bent in the direction of extension of the wire between a first connection point and a second connection point. The plurality of bending points include a first bending point at a height from the first connection point of at least 100 m and not more than 200 m, a second bending point at a distance from the first bending point in the horizontal direction of at least 100 m and not more than 270 m, and a third bending point at a distance from the intermediate point between the first electrode pad and the second electrode pad in the horizontal direction of within 150 m.

A method of testing a bonded wire on a wire bonding machine is provided. The method includes the steps of: (a) bonding a portion of a wire to a bonding location using a wire bonding tool on a wire bonding machine to form a bonded portion of the wire; (b) moving the wire bonding tool away from the bonded portion of the wire after step (a) with the wire engaged with the wire bonding tool; and (c) moving the wire bonding tool along a motion profile after step (b), with the wire engaged with the wire bonding tool to test the wire.