A packaging device including bumps and a method of manufacturing the packaging device are presented. In the method of manufacturing a packaging device, a dielectric layer that covers a packaging base is formed and a lower layer is formed over a packaging base including first and second connecting pads. A plurality of dummy bumps that overlaps with the dielectric layer is formed. A sealing pattern that covers the dummy bumps, filling areas between the dummy bumps, is formed. A lower layer pattern in which the plurality of dummy bumps have been disposed is formed by removing portions of the lower layer that are exposed and do not overlap with the sealing pattern.

In one example, an electronic device comprises a substrate having a first conductive structure, an electronic component coupled to the first conductive structure at a first side of the substrate, wherein the electronic component includes a first side facing the first side of the substrate and a second side opposite the first side, vertical interconnects around the electronic component, wherein the vertical interconnects are coupled to the first conductive structure at the first side of the substrate, an interposer having a second conductive structure coupled to the plurality of vertical interconnects, a thermal body coupled between the electronic component and the interposer, and an encapsulant between the substrate and the interposer, around the thermal body, around the plurality of vertical interconnects, and around the electronic component. Other examples and related methods are also disclosed herein.