A semiconductor package includes: a substrate; a chip stack on the substrate; a first interface, in a first region of the substrate and having a first circuit layer; a second interface, in a second region of the substrate and having a second circuit layer, and the chip stack between the first and second interface; a first bonding wire, connected to a first chip and having a first contact point; a second bonding wire, connected to a second chip and having a second contact point; an encapsulation layer, surrounding the chip stack, the first and second interface, the first and second bonding wire on the substrate, and exposing the first and second contact point, and the first and second circuit layer; and a redistribution layer, on the encapsulation layer and connecting the first contact point and the second contact point to the first circuit layer and the second circuit layer.

In examples, a package comprises a semiconductor die having a device side and a bond pad on the device side, a conductive terminal exposed to an exterior of the package, and an electrical fuse. The electrical fuse comprises a conductive ball coupled to the bond pad, and a bond wire coupled to the conductive terminal. The bond wire is stitch-bonded to the conductive ball.

A semiconductor device includes a mounting substrate having a first surface, a semiconductor chip mounted on the first surface and having a second surface facing a side opposite to the first surface, and a wire extending from a first joint point on the first surface toward a second joint point on the second surface and electrically connecting the mounting substrate and the semiconductor chip to each other by connecting the first joint point and the second joint point to each other. The wire includes a first part, a first bent portion, a second part, a second bent portion, and a third part arranged in order from the first joint point toward the second joint point. The first part is positioned on the first surface side with respect to the second surface when viewed in a first direction along the first surface and the second surface.