A method of forming a package structure includes disposing a die adhesive layer on a wafer, lowering a partial connecting property of the die adhesive layer, separating a plurality of dies of the wafer and disposing each of the dies on a leadframe. A connecting property of a partial area of the die adhesive layer is lowered, and the connecting property of the partial area of the die adhesive layer is corresponding to a plurality of cutting streets of the wafer. The dies are separated according to the cutting streets of the wafer. The partial area of the die adhesive layer is corresponding to a plurality of leads of the leadframe, and a connecting strength between the die adhesive layer and each of the leads is lower than a connecting strength between the die adhesive layer and a die pad of the leadframe.

A coating process of a coating liquid using a nozzle is performed on a coating target structure including a semiconductor element and a wire bonded to the semiconductor element by a wire bonding process. The nozzle has a transport wind generating function of generating a liquid transport wind in a spiral manner. Thus, the coating liquid discharged from the coating liquid supply port of the nozzle is supplied to the coating target structure along the directivity of the liquid transport wind. Then, a drying process is performed on the coating target structure to form a primary layer containing a silane coupling agent as a constituent material on an outer periphery of the wire.