A method for forming a package structure is provided. The method includes transporting a first package component into a processing chamber. The method includes positioning the first package component on a chuck table. The method includes using the chuck table to heat the first package component. The method includes holding a second package component with a bonding head. The bonding head communicates with a plurality of vacuum devices via a plurality of vacuum tubes, and the vacuum devices each operate independently. The method also includes bonding the first package component and the second package component in the processing chamber to form the package structure.

An electronic component mounting device (1) comprises: an electronic component supply unit (20) that supplies an electronic component having a bump electrode (EB); a transfer stage (31) that accumulates a flux (FX); a mounting stage (41) on which a substrate (BD) is placed; a plurality of heads that can each pick up an electronic component (CP); and a control unit (10) that controls movement of the plurality of heads. The control unit (10) is configured so as to cause each of the plurality of heads to function as a dipping head that dips the bump electrode (EB) of the electronic component (CP) into the flux (FX) accumulated on the transfer stage (31), or as a bonding head that mounts the electronic component (CP) to the substrate (BD) on the mounting stage (41) with the bump electrode (EB) interposed therebetween.

A laser compression bonding device comprises: a carrier for placing a substrate; a transparent compression head for holding and displacing an electronic component, wherein the transparent compression head comprises a central portion for pressing the electronic component against the substrate via a solder material when the electronic component is placed on the substrate via the solder material, and a peripheral portion surrounding the central portion; a laser source for emitting a laser beam towards the carrier at least through the central portion of the transparent compression head to heat the solder material such that the electronic component is bonded onto the substrate via the solder material; and a heat spreader attached to the peripheral portion of the transparent compression head, wherein the heat spreader comprises a liquid channel for containing liquid that flows in the liquid channel to exchange heat with the transparent compression head.