H10P70/10

SUBSTRATE PROCESSING METHOD

Provided is a substrate processing method, the method including: a substrate polishing operation of polishing a substrate; after the polishing operation, a treatment solution supplying operation of supplying a treatment solution containing a polymer and a volatile solvent onto the rotating substrate; after the treatment solution supplying operation, a liquid film forming operation of volatilizing the volatile solvent in the treatment solution to form a liquid film; and after the liquid film forming operation, an edge removing operation of removing the liquid film formed on an edge portion of the substrate and the edge portion of the substrate.