According to one embodiment, there is provided a semiconductor manufacturing tool that is capable of further facilitating an electrochemical process. The semiconductor manufacturing tool according to the embodiment includes a plurality of process baths, an anode and a cathode, and an electrical circuit. Each of the plurality of process baths is capable of containing a substrate processing liquid and a first substrate. The anode and the cathode are provided for each of the process baths. The electrical circuit electrically connects a plurality of first substrates held in the substrate processing liquid via the anode and the cathode and supplies electrical power via the anode and the cathode for subjecting the plurality of first substrates to an electrochemical process.

A method of applying a sinterable film to a substrate during a surface mount technology (SMT) process comprises: providing a substrate; providing a preform comprising a support film, the support film having a first surface and a second surface opposite the first surface, the support film being laminated with a sinterable film of metal particles (e.g., Ag, Ag alloy, Au, Au alloy, Cu, Cu alloy, Rd, Rd alloy, Ni, Ni alloy, Al, Al alloy, Ag-coated Cu, Cu-coated Ag) on the first surface but not on the second surface; providing a pick-and-place machine comprising a placement head; picking up the preform via the second surface using the placement head of the pick-and-place machine; placing the preform in contact with the substrate using the pick-and-place machine, wherein the contact is via the sinterable film; attaching the sinterable film to the substrate; and separating the support film from the sinterable film. The placement head may comprise a vacuum nozzle, wherein picking up the preform via the support film comprises applying a vacuum to the second surface using the vacuum nozzle. Separating the support film from the sinterable film may be carried out by moving the placement head of the pick-and-place machine away from the support film while maintaining the vacuum. The support film may be discarded from the pick-and-place machine by removing the vacuum. The support film may be used to manufacture a further preform.