A semiconductor device is made with a boat carrier including stainless steel. A Polytetrafluoroethylene (PTFE) layer is formed over the boat carrier. A semiconductor package substrate is disposed over the boat carrier. A manufacturing step is performed on the semiconductor package substrate. An electrostatic discharge (ESD) is imparted on the boat carrier during the manufacturing step. The semiconductor package substrate is protected from the ESD by the PTFE layer.