The present invention provides a pressing method and a pressing device. The method includes: providing an object to be pressed; providing a lower pressing die that is provided with a support seat for holding the object to be pressed; providing an upper pressing die that can be driven to move up and down relative to the lower pressing die; the upper pressing die is provided with plural plungers capable being driven to move up and down and a pressing block mechanism that can be pressed by the plungers; a load measuring unit is located among the plungers and the pressing block mechanism; when the object to be pressed is pressed, the upper pressing die firstly moves down to the pressing block mechanism to press the object to be pressed and drives the plungers to press the load measuring unit, such that the applied pressure can be accurately controlled.

A sintering apparatus for simultaneously sintering an electronic device onto a substrate, and a metallic sheet onto the electronic device includes a sinter tool and a compressible film positionable onto the metallic sheet and the electronic device. A thickness of the compressible film is greater than a height of the metallic sheet. The compressible film is adapted to conform to a shape of the metallic sheet and the electronic device to simultaneously cover the metallic sheet and at least a part of the electronic device when the sinter tool applies a sintering force onto the compressible film during a sintering process.