H10W20/091

Composition, pattern forming method, semiconductor device, and method for manufacturing semiconductor device
12590173 · 2026-03-31 · ·

According to one embodiment, a composition including a compound is provided. The compound includes a linking group containing 2 to 18 carbon atoms, a polymerizable functional group bonded to the linking group, a first reactive group bonded to the linking group, and a second reactive group bonded to the linking group. The polymerizable functional group includes at least one of a (meth)acryloyl group or a vinyl group. The first reactive group includes at least one selected from the group consisting of a thiol group, a disulfide group, and a thiocyanate group. The second reactive group includes at least one selected from the group consisting of an alkoxysilane group, a chlorosilane group, and a hydroxyl group.