Provided is a compression molding die. The die can be used for compression molding an I-shaped part without the need for machining. The molding die comprises: an outer mold with an inner diameter of d; an upper pressing disc, a lower pressing disc and a huff mold with the same outer diameter of d and the same inner diameter of f; an upper mold; a lower mold; and a core mold with a diameter of h. The upper pressing disc, the huff mold and the lower pressing disc, which are movable vertically, are arranged in the outer mold in a vertically spaced manner; the vertically movable upper mold extends into the upper pressing disc, and the vertically movable lower mold extends into the lower pressing disc; the outer mold, the upper mold, the upper pressing disc, the huff mold, the lower pressing disc and the lower mold define a cavity.

A fiber capsule and a method of compression molding a fiber-based packaging capsule, includes the steps: a raw capsule of a loosely bonded fiber mat is formed, which capsule has an opening; the raw capsule of the loosely bonded fiber mat is positioned on the inside of a substantially rigid mold having inner surfaces defining the molded outer surfaces of the fiber-based packaging capsule; the loosely bonded fiber mat is compression molded by the insertion of a pressurizable compression member through the opening. The pressing device is pressurized at a temperature of 150-250 degrees C.. The compression molding takes place by reshaping the reshaping pressing device and pressing the inside of the capsule against the inner surfaces of the rigid mold so that a cohesive fiber-based packaging capsule is obtained.

The technology provides for a cushion assembly or a tool for forming the cushion assembly for a patient interface delivery of a supply of pressurised air or breathable gas to an entrance of a patient's airways. The cushion assembly has an inferior surface and a mask connection portion, and includes a pad arranged on the inferior surface for sealingly contacting a wearer's face in use.

A headset can include a cable structure connecting non-cable components such as jacks and headphones. The cable structure can be constructed using a molding process. Different approaches can be used to ensure that a conductor bundle extending through the cable structure remains centered within the cable structure during the molding process. A movable tube can be placed in the mold such that the conductor bundle is retained within the tube. As material is injected into the mold and reaches the tube, the tube can be displaced and progressively removed from the mold. Alternatively, the movable tube can be constructed such that the tube may combine with injected material to form a shell of the cable structure. Gates from which material is provided in the mold can be positioned and controlled to facilitate the injection of material in the mold while maintaining the centered position of the conductor bundle.