B29C65/364

Hybrid braided composite parts
11141927 · 2021-10-12 · ·

Systems and methods are provided for fabricating a hybrid composite part. A method includes braiding a first set of fibers to form a weave having a closed cross-sectional shape, braiding a second set of fibers into the weave that are chemically distinct from the first set of fibers, impregnating the weave with a resin, and hardening the resin within the weave to form a hybrid composite part.

METHOD AND DEVICE FOR JOINING MOULDED PARTS BY ELECTROMAGNETIC WELDING

A method for joining moulded parts by electromagnetic welding. A joining inductor is moved along contact surfaces of the moulded parts, generating an electromagnetic field in an induction-sensitive component of the moulded part(s) to heat a thermally activated coupling means of the moulded part(s) to above a melting temperature of the coupling means. The strength of the electromagnetic field suitable for joining is determined by previously moving a sensing inductor along the contact plane, generating a relatively weak electromagnetic field to slightly heat the thermally activated coupling means to a sensing temperature, measuring the field strength generated by the sensing inductor in the moulded part(s), determining a discrepancy between the measured field strength of the sensing inductor and the field strength suitable for joining, and adjusting the field strength suitable for joining to close the discrepancy. A device for carrying out the method.

COMPOSITE MATERIAL FORMING METHOD AND COMPOSITE MATERIAL
20210170699 · 2021-06-10 ·

Provided a composite material forming method capable of easily using a composite material that is formed by causing a resin to react in a state where it is joined to another member; and a composite material. The composite material forming method includes a first material preparation step (magnetic field circuit forming material preparation step S11), a second material preparation step (magnetic field circuit non-forming material preparation step S12), a material assembly step S13, and a first heating step (magnetic field heating step S14). In the first material preparation step, a first material including a first resin is prepared. In the second material preparation step, a second material including a second resin is prepared. In the material assembly step S13, the first material and the second material are assembled to each other.

Bonding System and Bonding Method

A bonding system includes a supporting jig having a mounting surface on bonding substrates which are mounted, a bonding device that sandwiches and welds the bonding substrates between itself and the mounting surface, an articulated robot to which the bonding device is attached, and a control unit that controls the articulated robot and the bonding device.

APPARATUS AND METHODS FOR INSTALLING COMPOSITE RIVETS
20210129208 · 2021-05-06 ·

Apparatus and methods for installing composite rivets are disclosed. One disclosed method comprises: inserting a composite rivet blank comprising a composite material into a hole in a part; heating the composite rivet blank using Joule heating while the composite rivet blank is in the hole; and then finishing the composite rivet blank.

Method and installation for joining a cover layer to an object, as well as cover layer suitable for the method

A method and installation for joining a cover layer to an object in a continuous process. Joining is effected with the aid of a joining material having thermoplastic properties, wherein the joining material is arranged between the cover layer and the object and is liquefied using ultrasonic vibration energy. Before application of the ultrasonic vibration energy, the joining material is preheated in a contactless manner with the aid of electromagnetic induction in the region of the glass transition temperature of the joining material or above this glass transition temperature. The object is in particular a chip board and the cover layer an edge strip to be joined to an edge of the chip board.

Joining thermoplastic workpieces with induction heating

A method of joining workpieces includes the steps of bringing a first workpiece and a second workpiece together, induction heating a susceptor material, and pressing the workpieces together. Each workpiece may include a thermoplastic material, and the workpieces are brought together at a joint interface so that a protrusion of the first workpiece is aligned with a receptacle of the second workpiece. The susceptor material is in contact with the thermoplastic material of the first workpiece during heating such that the thermoplastic material of the first workpiece softens. The step of pressing is performed while the thermoplastic material of the first workpiece is softened, thereby reshaping the first workpiece where the susceptor material is in contact with the thermoplastic material of the first workpiece. The protrusion is deformed to form an interlock with the receptacle at the joint interface.

INDUCTION WELDING USING A HEAT SINK AND/OR COOLING

A heat sink for use in induction welding includes a flexible backing and a number of tiles disposed on the flexible backing in a single layer, wherein the tiles are electrically non-conductive and thermally conductive.

INDUCTION WELDING USING A HEAT SINK AND/OR COOLING
20210039332 · 2021-02-11 ·

A heat sink for use in induction welding includes a number of tiles, where the tiles are electrically non-conductive and thermally conductive, a joint flexibly joining the tiles together, and a fluid path formed through the heat sink for communicating a coolant therethrough.

INDUCTION WELDING USING A HEAT SINK AND/OR COOLING
20210039334 · 2021-02-11 ·

A method of dissipating heat from a surface of a first thermoplastic composite (TPC) being inductively welded with a second thermoplastic composite (TPC) includes flexing a heat sink during placement to conform to the surface of the first TPC, cooling the heat sink, applying inductive heat to a weld interface area between the first TPC and the second TPC, and drawing off heat via the heat sink from the surface of the first TPC.