A universal barrier system includes universal barrier components that may be assembled together to shield floors and walls from moisture and provide a thermal break in an operational area of the universal barrier component. A lap zone of the universal barrier component may allow universal barrier components to be assembled and installed to protect floors, walls, ceilings, footings and the like from moisture and heat gain or loss by minimizing the need for tapes and other joining methods. The universal barrier system may also act as a sound deadening material. The operational area and lap zone of the universal barrier component may be disposed on a vapor block layer to provide some rigidity. The operational area of the universal barrier component may include a thermal break disposed upon the vapor block layer. The thermal break may include an outer protective layer. In addition, universal barrier tape and universal barrier edging may be provided to couple adjoining universal barrier components.

A method for manufacturing components includes joining a first edge of a thermoplastic-containing first component part and a second edge of a thermoplastic-containing second component part to one another without any overlap. The first and the second edge are interconnected by friction stir welding. Friction stir welding involves rubbing a rotating friction stir welding pin against at least one metal object.

A process of curing a photo-curable material includes dispersing a microcapsule in a material that includes a photo-initiator and a photo-curable material. The process also includes applying a stimulus to the microcapsule to trigger a chemiluminescent reaction within the microcapsule. The chemiluminescent reaction generating a photon having a wavelength within a particular emission range that is consistent with an absorption range of the photo-initiator. The photon exits the microcapsule to trigger the photo-initiator to initiate or catalyze curing of the photo-curable material.

A resin film laminated on a support film is attached to the surface of a substrate having a pattern of unevenness. Firstly, the substrate is placed on a stage with the surface side up. Secondly, the resin film is placed so as to face the surface of the substrate and the surface is scanned with a roller while the resin film is pressed against the surface from the side of the support film to bring them into contact with each other. Surface temperatures of the stage and the roller are set to form a temperature gradient such that the temperature of the surface of the resin film to be attached to the surface of the substrate becomes not lower than the softening temperature of the resin film and the temperature of the surface of the support film side becomes lower than the softening temperature of the resin film.

A process of utilizing a light generating microcapsule to cure a photo-curable material includes dispersing a microcapsule in an interface material that includes a photo-initiator and a photo-curable material. The process also includes applying a stimulus to the microcapsule to trigger a chemiluminescent reaction within the microcapsule. The chemiluminescent reaction generating a photon having a wavelength within a particular emission range that is consistent with an absorption range of the photo-initiator. The photon generated within the microcapsule exits the microcapsule into the interface material to trigger the photo-initiator to initiate or catalyze curing of the photo-curable material.

An assembly comprises a housing, a bezel and a lens, or a housing heat sink, a housing rim, a bezel and a lens, wherein the housing or the housing heat sink comprises a first surface and the bezel or the housing rim comprises a second surface, a portion of a first surface of the housing or housing heat sink is molded to a portion of the second surface forming an interface surface, the interface surface having an interface angle that does not deviate more than 90 degrees, measured from a central axis perpendicular to the bezel and the housing around which the bezel and the housing are molded, for all interface angles about the central axis.

A universal barrier system includes universal barrier components that may be assembled together to shield floors and walls from moisture and provide a thermal break in an operational area of the universal barrier component. A lap zone of the universal barrier component may allow universal barrier components to be assembled and installed to protect floors, walls, ceilings, footings and the like from moisture and heat gain or loss by minimizing the need for tapes and other joining methods. The universal barrier system may also act as a sound deadening material. The operational area and lap zone of the universal barrier component may be disposed on a vapor block layer to provide some rigidity. The operational area of the universal barrier component may include a thermal break disposed upon the vapor block layer. The thermal break may include an outer protective layer.

An assembly comprises a housing, a bezel and a lens, or a housing heat sink, a housing rim, a bezel and a lens, wherein the housing or the housing heat sink comprises a first surface and the bezel or the housing rim comprises a second surface, a portion of a first surface of the housing or housing heat sink is molded to a portion of the second surface forming an interface surface, the interface surface having an interface angle that does not deviate more than 90 degrees, measured from a central axis perpendicular to the bezel and the housing around which the bezel and the housing are molded, for all interface angles about the central axis.

The core metal for resin welding improves bonding strength between an outer peripheral resin member and the core metal. The outer peripheral resin member 30 is welded to the peripheral surface 21 of the core metal 20 by fitting the core metal into a fitting hole 31 of the outer peripheral resin member 30, preparing the outer peripheral resin member 30 providing the fitting hole 31 with a smooth internal wall surface; preparing the core metal 20 wherein streaky protrusions 26 and smooth portions 25 are provided; allowing the top parts of the protrusions 26 to contact, and the smooth portions of the core metal 20 to face the smooth internal wall surface; and induction heating to weld the outer peripheral resin member 30 to the protrusions 26 and the smooth portions 25.

A process of utilizing a light generating microcapsule to cure a photo-curable material includes dispersing a microcapsule in an interface material that includes a photo-initiator and a photo-curable material. The process also includes applying a stimulus to the microcapsule to trigger a chemiluminescent reaction within the microcapsule. The chemiluminescent reaction generating a photon having a wavelength within a particular emission range that is consistent with an absorption range of the photo-initiator. The photon generated within the microcapsule exits the microcapsule into the interface material to trigger the photo-initiator to initiate or catalyze curing of the photo-curable material.