B29C66/73141

Device and method for bonding substrates

A method for bonding a contact surface of a first substrate to a contact surface of a second substrate comprising of the steps of: positioning the first substrate on a first receiving surface of a first receiving apparatus and positioning the second substrate on a second receiving surface of a second receiving apparatus; establishing contact of the contact surfaces at a bond initiation site; and bonding the first substrate to the second substrate along a bonding wave which is travelling from the bond initiation site to the side edges of the substrates, wherein the first substrate and/or the second substrate is/are deformed for alignment of the contact surfaces.

Device and method for bonding substrates

A method for bonding a contact surface of a first substrate to a contact surface of a second substrate comprising of the steps of: positioning the first substrate on a first receiving surface of a first receiving apparatus and positioning the second substrate on a second receiving surface of a second receiving apparatus; establishing contact of the contact surfaces at a bond initiation site; and bonding the first substrate to the second substrate along a bonding wave which is travelling from the bond initiation site to the side edges of the substrates, wherein the first substrate and/or the second substrate is/are deformed for alignment of the contact surfaces.

Device and method for bonding substrates

A method for bonding a contact surface of a first substrate to a contact surface of a second substrate comprising of the steps of: positioning the first substrate on a first receiving surface of a first receiving apparatus and positioning the second substrate on a second receiving surface of a second receiving apparatus; establishing contact of the contact surfaces at a bond initiation site; and bonding the first substrate to the second substrate along a bonding wave which is travelling from the bond initiation site to the side edges of the substrates, wherein the first substrate and/or the second substrate is/are deformed for alignment of the contact surfaces.

Composite structures having bondlines with matched electrical conductivity

Two composite laminates are joined together by a bondline having portions exposed to the ambient environment. The bondline contains scrim having an electrical conductivity and impedance matched to that of the laminates in order to mitigate effects of lightning strikes.

Composite strip, and methods for forming a junction between two conduits

A composite strip which extends in a main direction between first and second ends and which comprises a main strip comprising first fibres embedded in a matrix. The first fibres are made of carbon, an electrically conducting material, and the matrix is made up of at least one polymer. The composite strip further comprises a junction layer formed of an electrically conducting junction material. The junction layer is placed on the main strip.

CONDUCTIVELY COATED FASTENING SYSTEMS FOR FULL SIZE DETERMINANT ASSEMBLY (FSDA)
20210210873 · 2021-07-08 ·

Conductively coated fastening systems are disclosed herein. An apparatus includes a fastening system and a structural assembly. The structural assembly comprises a first structural element made of an electrically conductive fiber reinforced plastic and a second structural element. The first structural element comprises a first hole and the second structural element comprises a second hole. The first and second holes are separately pre-formed prior to assembly of the structural assembly. The structural assembly further comprises an electrically conductive gap filler applied to a first structural element sidewall of the first hole of the first structural element. The fastening system comprises a fastener comprising a head and a shank extending from the head. The shank is configured to be inserted into the first hole and the second hole.

Plastic moulding for a moulding arrangement, corresponding moulding arrangement, and method for producing a moulding arrangement
10864681 · 2020-12-15 · ·

The application relates to a plastic moulding for a moulding arrangement including a housing for another plastic moulding of the moulding arrangement, wherein the housing is formed within a moulding body of the plastic moulding including a weldable material in at least some areas. It is contemplated therein that a contact element is arranged on the moulding body, the contact element at least partly including an electrically conductive material and limiting a recess of the moulding body adjoining the housing in at least some areas. The application further relates to a moulding arrangement and a method for producing a moulding arrangement.

FABRICATION PROCESS FOR MAKING ELECTROCHEMICAL MULTILAYER MEMBRANE MATERIALS
20200373598 · 2020-11-26 ·

A method for fabricating an electrochemical sensor material includes positioning sheets of molded graphene nanoplatelets on each side of a proton exchange membrane and integrating graphene nanoplatelets into regions of the proton exchange membrane adjacent its surfaces by applying heat to increase the temperature of the proton exchange membrane to its glass transition temperature and applying compressive pressure to press a portion of each sheet of molded graphene nanoplatelets into the softened polymeric material of the proton exchange membrane. Following application of heat and pressure, the proton exchange membrane is cooled and excess graphene material is exfoliated. Electrochemical sensor components are cut from the material and electrochemical devices and systems are constructed therefrom.

SENSOR DEVICE, METHOD OF MANUFACTURING SENSOR DEVICE, AND VEHICLE SEAT

A sensor device has an insulative non-woven fabric and a conductive fabric forming an electrode. The conductive fabric is joined to one surface of the non-woven fabric by at least one of fusion and seaming.

Method of manufacturing multiple fuel cell separator plate assemblies

A method of manufacturing a flow field plate includes mixing graphite and resin materials to provide a mixture. The mixture is formed into a continuous flow field plate, for example, by ram extrusion or one or more press belts. The continuous flow field plate is separated into discrete flow field plates. Flow field channels are provided in one of the continuous flow field plate and the discrete flow field plates.